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6-layer PCBs are an economical and popular stackup for a variety of applications with high net count and small size. Larger boards might work fine with a 4-layer stackup, where signal layers can be sacrificed to ensure isolation between each side of the board. With the right 6-layer stackup, you can suppress EMI between different layers and accommodate fine-pitch components with high net count. However, there are cases where it makes more sense...

Today's high-speed embedded systems incorporate diverse functionality, components, digital interfaces, and of course, wireless/RF signaling. If you're designing embedded systems with any level of computing power that also includes an analog front end, then you have multiple mixed-signal design challenges to overcome. Whether it's a simple sub-1 GHz radio connection, Wifi/BLE, or multi-gigabit Ethernet, embedded systems need some way to...

In a previous article, we established that loss is one of the primary signal integrity challenges to overcome. In this article, we’ll talk about the sources of loss, what you can do about them, and an often neglected aspect of loss. There are various options for reducing loss, in this article I’ll discuss how to: Change your architecture to orthogonal or cables Use better PCB materials with lower DF resin and smoother copper Add active...

Today we talk to Yizhak Bot who started his career in the Israeli DOD, and today he will share with us what derating is and how you can work on the schematic level with their simulation software to eliminate field failures. With a background including about ten years working with the reliability of very big systems gaining much insight into how systems work and fail, Yizhak is an expert you’ll want to listen in and learn from. Today he is the...