1:06 Unified Design Environment - Benefits:PCBWorksvid Watch Video Designing a 6-Layer PCB Stackup for Enhanced EMC 6-layer PCBs are an economical and popular stackup for a variety of applications with high net count and small size. Larger boards might work fine with a 4-layer stackup, where signal layers can be sacrificed to ensure isolation between each side of the board. With the right 6-layer stackup, you can suppress EMI between different layers and accommodate fine-pitch components with high net count. However, there are cases where it makes more sense Read Article Tips for High Frequency PCB Design in Embedded Systems Today's high-speed embedded systems incorporate diverse functionality, components, digital interfaces, and of course, wireless/RF signaling. If you're designing embedded systems with any level of computing power that also includes an analog front end, then you have multiple mixed-signal design challenges to overcome. Whether it's a simple sub-1 GHz radio connection, Wifi/BLE, or multi-gigabit Ethernet, embedded systems need some way to interface Read Article DFSI: Overcoming Channel Loss In a previous article , we established that loss is one of the primary signal integrity challenges to overcome. In this article, we’ll talk about the sources of loss, what you can do about them, and an often neglected aspect of loss. There are various options for reducing loss, in this article I’ll discuss how to: Change your architecture to orthogonal or cables Use better PCB materials with lower DF resin and smoother copper Add active repeaters Read Article Design for Reliability with Yizhak Bot Design for Reliability. In this episode learn from Yizhak Bot what derating is and how you can work on the schematic level with their simulation software to eliminate field failures. Watch it here. Read Article Weekly Digest: Preparing for IPC-6012E This week HDI expert Happy Holden reported on an important issue related to the upcoming IPC-6012E, Qualification and Performance Specification for Rigid Printed Boards in his article, The IPC Warning About Microvia Reliability for High Performance Products . Learn more about this warning regarding field and latent failures of high-profile HDI boards and what you can do if you want to get involved or get more information. Access Happy’s article Read Article 5:33 Top 5 reasons to upgrade Watch Video Materials Science 101 with EIPC Chairman Alun Morgan How to choose materials? Talk to your manufacturers about the correct materials for your PCB Design, or click here to watch Judy Warner's interview with the materials scientist, Alun Morgan. Read Article 40:17 Altium Designer 19: Advanced Layer Stack Manager Watch Video PCB Manufacturing Cost vs. Value: The Economics of PCB Design Every decision made in the design process of any PCB or system has an economic as well as an engineering effect. Some of these effects are more visible or tangible than others but if the “dollars and cents” elements are weighted along with the design decisions it is more likely that that the resulting product will be both economically efficient and well-engineered. As with most everything in life, price and cost are not the same things Read Article How to Reduce and Remove Noise In Analog Signals From Your PCB On my 12th birthday, I received my very own stereo system, complete with 4 speakers, a CD changer, and a tape deck. My parents found my taste in 80s hair metal pretty annoying, but I couldn’t get over the annoying hum coming from the speakers after a CD ended. Noise in analog systems, and analog noise in general, can present serious problems in a number of applications. Examples include systems for precise measurement, power systems, and radios Read Article Guard Traces: Hit or Myth? Guard traces on a PCB layout are another topic area where there continues to be a lot of conflicting information. You can find a lot of different references to their use. There is confusion as to which types of designs—analog circuit, mixed-signal or digital—supposedly benefit the most from the use of guard traces; how guard traces block EM fields; the importance of having the trace ends be floating, grounded on one end or grounded on both ends Read Article Weekly Digest: Join the Fastest Growing Software in ECAD This week, we were so excited to see one of our own in I-Connect 007 , Andy Johnson who was a big part of bringing the new Academic Program to fruition (check out the awesome video ). It’s no surprise to us that so many talented young folks want to join the Altium team. We’re growing! And did you know that Altium Designer® software is the most popular EDA tool on the market? That’s right, and there are plenty of reasons why. So consider joining Read Article The IPC Warning About Microvia Reliability for High Performance Products Hopefully, by now, you have read the full Press Release from the IPC on March 6, 2019, about the warning of field and latent failures of high-profile HDI boards. IF not, the complete press release is available on I-Connect 007 . [1] What you may have seen is the warning statement which the IPC will be including in the upcoming IPC-6012E, Qualification and Performance Specification for Rigid Printed Boards : “There have been many examples of post Read Article Sometimes, You Can't Do it Alone When it comes to design, most engineers do it alone. It's not that engineers are anti-social. That's a played out trope. It has more to do with the reality engineers can split up design work into independent finite chunks of work. Board development work, however, is changing. There more and more use cases where an engineer can't do their tasks in isolation. In this post, we'll explore a couple of those scenarios, look at the implications of using Read Article From CAD to PCB: The Data You Give Me and What I Actually Do With It From CAD to PCB, 60% of jobs go on hold! Watch this episode and find out how to provide exactly what your manufacturer needs to prevent delays and what really happens when you send your data package. Read Article Design for Manufacturing and Assembly (DFM/A) or Predictive Engineering Advances in interconnection technologies have occurred in response to the evolution of component packages, electronic technology and increasing complex functions. The printed circuit, therefore, has become the most popular and cost-efficient way to physically execute an electronic circuit. Fabrication, assembly and test technologies have responded by making their technologies more complex. The increased complexity and capabilities have made Read Article Pagination First page « First Previous page ‹‹ Page102 Current page103 Page104 Page105 Page106 Page107 Next page ›› Last page Last » Load More