This presentation details the development of high reliability base materials for PCBs with a focus on thermal performance, reliability and signal integrity. Classification by application as a method of substrate selection will be explored. This methodology gives the designer the flexibility to select the appropriate substrate for an application without over engineering performance that is neither required nor can be afforded.
The presentation includes a straightforward guide to the PCB substrate manufacturing process emphasizing the impact of resin chemistry, material reinforcement and copper foil properties on substrate performance.
View Thomas Wischnack's presentation slides and watch video clips below:
Thomas Wischnack on Common Pitfalls and Case Grounding
Thomas Wischnack on Copy and Paste Libraries
Thomas Wischnack on Connector Placement
Thomas Wischnack on Common Mode Chokes and Ground Layout
Thomas Wischnack on Filter Placement
Thomas Wischnack on Layer Stack
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