Semi-Additive Process Technology at Averatek

February 26, 2019 Judy Warner

In today’s OnTrack Podcast Judy talks to Mike Vinson, the COO of Averatek about their breakthrough innovation in which they use a semi-additive process incorporating a liquid metal ink as the catalyst seed layer. This special catalytic precursor “ink” can be imaged to create the patterns or areas where conducting metal is to be deposited. This ink controls the horizontal dimensions of line width and spacing and creates the ability to get down to 1 mm and sub-1 mm line and traces. Keep an eye on this technology!

Listen to the Podcast:

Download this episode (right click and save)

Watch the Video:

Show Highlights:

  • Mike’s background is in semiconductors primarily in the area of interconnects.
  • At Averatek they create HDI solutions.
  • What does Averatek’s technology enable engineers and product developers to realize? Lower layer count, Improve Yield, Cost reduction and High Value
  • What is Semi-Additive Process Technology? Fundamentally the ink carries plating onto the surface of the substrate, depositing them in very thin layers.
  • Also called atomic layer deposition - Averatek calls it lipid metal ink.
  • Process allows for very precise and very small circuits.
  • Learn the jargon: SAP (Semi-Additive Process).
  • Copper can be left undisturbed by the etching process.
  • Can be run in a traditional board shop - new technologies are emerging.
  • Lithography capital equipment is indeed a worthwhile investment.
  • Liquid Metal Ink where are you in getting this to market? Strategy is to license and sell liquid metal ink.
  • What type of design considerations will EDA tools need to build-in to enable design with this technology? Smaller lands and increased density.
  • Evolution: Lines & Spaces first then other areas.
  • Thieving areas parameters will change.
  • This tech will work for both flex, rigid-flex, and rigid circuits.

Links and Resources:

Averatek website

Email: mike@averatek.com

Preview to Apex - this was both Mina and SAP and mSAP focused

Additive Electronics  PCB Scale to IC Scale

Flex Circuit Firsts - mentioned Averatek

E-textiles - wild frontier

Medical research is Golden - additive process and gold conductors

Trade In Your Outdated PCB Design Tool & Unlock 45% OFF Altium today!

 

Click here to view all Episodes

Or click here to access the Altium Free Trial Today.

 

 

About the Author

Judy Warner


Judy Warner has held a unique variety of roles in the electronics industry since 1984. She has a deep background in PCB Manufacturing, RF and Microwave PCBs and Contract Manufacturing with a focus on Mil/Aero applications in technical sales and marketing.

She has been a writer, contributor and journalist for several industry publications such as Microwave Journal, The PCB Magazine, The PCB Design Magazine, PDCF&A and IEEE Microwave Magazine and is an active member of multiple IPC Designers Council chapters.

In March 2017, Warner became the Director of Community Engagement for Altium and immediately launched Altium’s OnTrack Newsletter.
She led the launch of AltiumLive: Annual PCB Design Summit, a new and annual Altium User Conference.

Judy's passion is to provide resources, support and to advocate for PCB Designers around the world.

Follow on Twitter Follow on Linkedin Visit Website More Content by Judy Warner
Previous Article
Utilizing Layout Options for Rigid-Flex Design
Utilizing Layout Options for Rigid-Flex Design

Need to design your next great rigid-flex board? Try working in Altium Designer’s unified environment.

Next Article
Flex Cost Drivers and Next Gen Technologists, a conversation with Tara Dunn from OMNI PCB
Flex Cost Drivers and Next Gen Technologists, a conversation with Tara Dunn from OMNI PCB

Let's talk about Flex and the cost drivers. How does material selection, panel utilization and technology a...