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Via protection is an important part of modern PCB design. It provides additional benefits in PCB manufacturing and assembly, increasing the number of acceptable products. There are several types of vias protection detailed in the IPC-4761 Design Guide for Protection of Printed Board Via Structures and on pages 5-11 of this document. Advantages of Via Protection Common situations where vias protection is recommended or required: Support For...

Just as you get used to PCIe 5.0, they decide to release another standard! Ever since PCI Express was introduced as a replacement for the original PCI specification, the PCI-SIG standard group has doubled the bandwidth approximately every 3 years. The cadence of performance changes and bandwidth increases suddenly hastened around the time of PCIe Gen4, with the current time between generational releases of about 2 years. Since its introduction...

I am very enthusiastic about the semi-additive processes now available to PCB fabricators of all sizes and spend a fair amount of time talking about potential designs that could benefit from the ability to route with 15 micron or 25-micron trace and space.  While mSAP has been utilized in select very high-volume manufacturing facilities in Asia, for technology such as smart phones, it is a technology that has largely been unavailable for low to...

The business development manager of J.A.M.E.S., Alexandre Schafer, talks about the organization's vision to push the Additively Manufactured Electronic technology to become more accessible to the industry. Listen to Podcast: Download this episode (right-click and save) Watch the Video: Show Highlights: What is J.A.M.E.S., and how did Alexandre become involved in the organization? J.A.M.E.S (Jetted Additively Manufactured Electronic...

When it's time to release your project to your manufacturer, it's essential to ensure that all the necessary design aspects like assembly, BOM, and documentation are accurately and completely conveyed. Consistency is key to ensuring a successful release. Without clear release documentation, the designer faces increased risks of costly manufacturing respins, time-consuming rework, or unintentional defects that can make it into the final product...

When it's time to release your project to your manufacturer, it's essential to ensure that all the necessary design aspects like assembly, BOM, and documentation are accurately and completely conveyed. Consistency is key to ensuring a successful release. Without clear release documentation, the designer faces increased risks of costly manufacturing respins, time-consuming rework, or unintentional defects that can make it into the final product...

When it's time to release your project to your manufacturer, it's essential to ensure that all the necessary design aspects like assembly, BOM, and documentation are accurately and completely conveyed. Consistency is key to ensuring a successful release. Without clear release documentation, the designer faces increased risks of costly manufacturing respins, time-consuming rework, or unintentional defects that can make it into the final product...

When it's time to release your project to your manufacturer, it is essential to ensure that all the necessary design aspects like assembly, BOM, and documentation are accurately and completely conveyed. Consistency is key to ensuring a successful release. Without clear release documentation, the designer faces increased risks of costly manufacturing respins, time-consuming rework, or unintentional defects that can make it into the final product...

SPI and I2C are probably the most commonly used digital protocols to connect integrated circuits in a diverse array of products. SPI and I2C are both easy-to-use, hard-to-break serial digital protocols that are quite easy to route from a signal integrity perspective. Unlike impedance-controlled high-speed differential serial protocols, these two protocols do not have an impedance specification and will often be considered electrically short. This...