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The next great developments in IoT products are in edge computing. The term “cloud computing” is now a regular piece of technical vocabulary, and for some time it was viewed as the solution to every data-intensive computing problem. While cloud computing certainly gives many developers a simple way to create value and scale quickly, edge computing is quickly becoming a viable alternative to deploying software applications on the cloud. In fact...

As with any job, Signal Integrity engineers use niche tools. SI tools are often thought of as S-parameter viewers, 3D EM solvers, or measurement equipment. These tools have one thing in common: analysis. What about the devices that SI engineers deploy to make their lives easier? In this article, I’ll discuss three devices to save time and money: multiport test cables, RF switches, and the old RC filter. Multi-port RF Cable Assemblies Today’s...

Artist's impression of MEV-1 (silver) attached to communications satellite (copper) (Image source: Northrop Grumman) Things are moving quickly in space these days (no pun intended). I like to think that I keep my ear to the ground, but I was surprised to discover that Northrop Grumman's Mission Extension Vehicle-1 (MEV-1), whose mission is to essentially act as a space tow truck, successfully launched a week ago. Riding on top of a Russian...

  In Continuous Integration and Deployment in ECAD we discussed the concept of Continuous Deployment within a build system. In this article, we will take a deeper look at how to set up continuous delivery and deployment systems so your team and vendors can enjoy a continuous stream of updated ECAD packages for review. Continuous Deployment/Delivery: Revisited In Continuous Integration: An Implementation Using Altium Designer we went through...

  As noted in several of my previous articles as well as a large majority of other published documents, component lead pitches have become increasingly fine, and smaller form factor devices have come to dominate a large number of the products (cell phones) being developed today. The question of how to connect components to both sides of these crowded PCBs should be among the first factors taken into account by a product development team...