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Hopefully, by now, you have read the full Press Release from the IPC on March 6, 2019, about the warning of field and latent failures of high-profile HDI boards. IF not, the complete press release is available on I-Connect 007. [1]   What you may have seen is the warning statement which the IPC will be including in the upcoming IPC-6012E, Qualification and Performance Specification for Rigid Printed Boards: “There have been many examples of...

When it comes to design, most engineers do it alone. It's not that engineers are anti-social. That's a played out trope. It has more to do with the reality engineers can split up design work into independent finite chunks of work. Board development work, however, is changing. There more and more use cases where an engineer can't do their tasks in isolation. In this post, we'll explore a couple of those scenarios, look at the implications of...

Gerry Partida, Director of Engineering at Summit Interconnect Technologies, a world class PCB Fabricator, is back to discuss your data package and what he actually does with it. Gerry began his career in the Printed Board industry in 1984 at Everett Charles Test Equipment and joined Optrotech/Orbotech in 1986. He was a member of the team that introduced CAM automation, net list compare, AOI Cad Reference to industry. His current position is...