The aerospace industry has an unquenchable thirst for new technologies that can improve craft performance and capabilities. This ongoing desire for more speed, less weight, better efficiency and new capabilities drives continual technological advancements in electronic components and aerospace design approaches.
From the smallest CubeSats to the largest airliners, the latest components are taking aerospace into a higher orbit. For example, gallium nitride on silicon carbide (GaN-on-SiC) amplifiers are revolutionizing satellite communications, while carbon nanotube wiring promises to slash aircraft weight. Quantum sensors offer unprecedented navigation accuracy, and neuromorphic chips promise to bring us closer to creating truly autonomous intelligent drones.
Today’s aerospace engineers face the exciting challenge of integrating these cutting-edge components into next-generation aircraft and spacecraft. Whether working on advanced avionics, electric propulsion systems or space-hardened computing platforms, understanding the following six influential trends will make you indispensable in the evolving aerospace sector.
GaN-on-SiC amplifiers are widely used in high-performance applications, including satellite communications, radar systems and RF/microwave systems. The success of satellite-based internet services (such as SpaceX's Starlink) and other satellite networks is expected to be a key driver of continued growth for GaN-on-SiC.
These power amplifiers offer higher efficiency, broader bandwidth and improved thermal performance compared to traditional options. For designers, GaN-on-SiC is an essential building block for the creation of more compact, powerful and reliable satellite communication systems.
Qorvo is one of the leaders in RF solutions today. The company’s QPA GaN power amplifiers for radar, satellite communication and defense systems are well-known for their high power, efficiency and linearity.
Radiation-hardened field-programmable gate arrays (FPGAs) can withstand the extreme conditions of space, including exposure to high levels of radiation that cause regular electronic components to malfunction. The latest products offer higher logic density and lower power consumption, enabling more complex in-orbit processing.
These devices are designed to resist single-event upsets (SEUs) and other forms of radiation-induced damage. They are programmable after deployment, offering unprecedented flexibility for space-based computing systems by enabling in-orbit reconfiguration and updates. This flexibility is extremely valuable for adapting to unforeseen challenges or updates in mission requirements.
AMD’s Space-Grade Kintex™ UltraScale™ XQR FPGA family stands out in this arena. These space-age devices offer up to 446K logic cells and are qualified to 100 krad(Si) total dose, making them suitable for a wide range of space applications.
Optical interconnects are increasingly replacing traditional copper wiring in avionics systems. This shift is driven by the need for higher data bandwidth and the advantages of optical fibers in reducing electromagnetic interference (EMI). Because optical fibers are immune to EMI, they improve the reliability of data transmission in noisy electronic environments. They also offer significantly higher bandwidth compared to copper, offering better performance for data-intensive applications.
Real-time sensor fusion – where data from multiple sensors is combined and processed in real time – calls for the high bandwidth and low latency of optical connections. Similarly, high-resolution displays in modern cockpits and passenger entertainment systems require huge amounts of data to be transmitted quickly and reliably, making optical interconnects a compelling option.
TE Connectivity's VITA 66.5 ruggedized optical backplane interconnects are gaining traction in aerospace with support for data rates up to 25 Gbps per channel. The VITA 66.5 standard ensures that they are ruggedized to withstand the tough conditions found in aerospace applications, including significant temperature variations, mechanical stress and exposure to extreme vibration.
Quantum sensors leverage quantum phenomena – such as superposition and entanglement – to achieve precision far beyond that of traditional GPS or inertial systems. For example, quantum accelerometers can detect very minute changes in motion and orientation with extreme precision, enabling more reliable deep-space navigation where conventional systems would fail. Quantum sensors will likely become an essential component for the future of exploring deep space.
Infleqtion’s ColdquantaLabs quantum core technology platform supports the development of a range of quantum devices, including highly precise atomic clocks and accelerometers. This platform provides the essential tools and infrastructure needed for creating next-generation navigation systems, paving the way for groundbreaking accuracy for space exploration, military operations and advanced navigation systems.
Neuromorphic computing chips are designed to mimic the architecture of the human brain. This architecture enables neuromorphic chips to process information in parallel and with high efficiency, making them particularly advantageous for autonomous systems like drones. These chips excel at pattern recognition, decision-making and real-time processing, all of which are critical for drones and other autonomous vehicles that must self-navigate and dynamically respond to their environment.
Neuromorphic chips perform complex computations while consuming significantly less power compared to traditional processors. This is especially valuable for battery-powered drones, where energy efficiency directly impacts flight time and autonomous functionality. As designers of drone AI systems begin to leverage these new chips, the potential for creating fully autonomous and highly intelligent drones is becoming increasingly feasible.
Intel's Loihi 2 neuromorphic chip is a good example of this technology. While not specifically designed for aerospace, the Loihi 2 chip has features that make it a likely candidate for autonomous drone systems of the future. While neuromorphic chips like Loihi 2 are still undergoing research and development for aerospace applications, their potential as a game-changer for autonomous systems is widely recognized.
Carbon nanotube wiring has the potential to significantly reduce aircraft weight – improving fuel efficiency and payload capacity – while also boosting electrical and thermal conductivity. The challenge? The technology remains in a mostly developmental stage. Integrating carbon nanotube wiring into existing design processes and ensuring long-term reliability remain formidable challenges.
One pioneer in this field, Nanocomp Technologies (part of Huntsman Corporation) produces Miralon carbon nanotube sheets and yarns. These materials could soon replace traditional copper wiring, delivering weight savings of up to 70%.
The electronic components driving aerospace innovation are rapidly evolving, offering exciting opportunities for designers and engineers. These advancements – from GaN-on-SiC amplifiers to quantum sensors – are enabling lighter, more efficient and more capable aerospace systems. As the industry moves toward electric propulsion, autonomous flight and expanded space exploration, mastering these technologies will be essential.
We must all strive to practice personal agility, continually learning and adapting to these new technologies. Curiosity, diligence and creativity are the keys to success. By embracing these trends and the components that enable them, aerospace professionals can create the next generation of aircraft and spacecraft that will shape our future in the skies and beyond.