High-Speed Board Design Rules to Get Your PCB Designed Right the First Time

February 4, 2019 Shlomi Zigdon

Understanding the principles of signal/power integrity and EMI by the electronic engineer is necessary, but unfortunately our experience does not guarantee the successful functioning of the system. Converting the principles into quantities built by the PCB layout designer will bring us closer to this goal. This lecture will cover 10 critical issues regarding the return current path and bypass capacitors roles, cross talk by coupling, Faraday cages by layers construction and best routing techniques for minimizing the return current loops. All of these topics are converted into a guide that is concise but effective and proven to achieve these goals.  

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About the Author

Shlomi Zigdon


Shalom-Shlomi Zigdon, founder and CEO of iTech-iCollege Academy for PCB & Board Design, has 40 years of experience in electronics engineering. For the past 20 years, he has been a lecturer for high-speed board design, signal integrity and EMC for R&D teams in the USA and Europe. As a consultant, he helps engineers advance to the highest data rates by teaching fundamental concepts for designing better systems.

Through his consulting, he also demonstrates better ways to find and evaluate design problems and their solutions by anticipating future issues in the final project during the design session. His personal experience in HW R&D and PCB layout design gave him the practical knowledge to close the gap between the schematic and the real world of PCB designs and components.

Shlomi is an EDI CON TAC member, a senior lecturer at Boston & Santa Clara Conferences in the USA, and a Chairman of the IEEE EMC & SI/PI Symposium at Israel 2014-2018. He is also a committee member of three IPC standards committees.

Formerly, he served as CEO and VP of Medical Simulator, a hardware engineer at Israel Aircraft Industries, a technologist for PCB & MCM at Elbit System, and a consultant of projects at Intel, Motorola, Western-Digital, Philips, BD, Siemens, Tyco, Philips, Rafael, Military and Avionic Industries.

Has been involved with Electronic engineering for 40 years. The founder and CEO of iTech-iCollege Academy for PCB & Board Design. For last 20 years he is a lecturer for high-speed board design for signal integrity and EMC for R&D teams in the USA & Europe. As a Consultant he helps engineers advance to the highest data rates by teaching the concepts engineers need to design better systems and better ways to find problems and come up with solutions, by expecting the future problems in the final project during the Design session. His personal experience in HW R&D and PCB Layout Design gave him the practical knowledge to close the gap between the the Schematic and the Real world of PCB & Components.

He is an EDI CON TAC member and a Senior Lecturer at Boston & Santa Clara Conferences in the USA and a Chairman of the IEEE EMC & SI/PI Symposium at Israel 2014-2018.

He is a committee member of the following IPC standards committees: IPC-2251 High Speed Board Design; IPC-2221 PCB Design; IPC-2226 HDI [High Density Interconnection] PCB Design.

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