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Many products are manufactured on four-layer PCBs, and these are something of an entry-level stackup for many designs. From a signal integrity and EMI/EMC standpoint, the easiest four-layer stack to use is the Sig/GND/GND/Sig stackup, as it enables high-speed digital routing with controlled impedances on both sides of the board, but without a requirement for coplanar ground on the surface layers. Although this is the best stackup from a signal...

In high-speed printed circuit board (PCB) design, ensuring signal integrity is crucial to achieve reliable and efficient performance. Signal integrity refers to the preservation of the quality of electrical signals as they travel through the PCB, free from distortion and noise. Several factors influence signal integrity, including via design, ground plane strategies, and design for manufacturability (DFM). This article explores these critical...

Effective Bill of Material (BOM) management is a critical aspect of product design, particularly in the electronics industry. The electronics BOM lifecycle begins at the concept phase and continues through to the prototype phase, each stage presenting unique challenges and opportunities. This article provides key insights into managing BOMs during these initial phases, offering practical strategies for product designers to ensure accuracy...

Effective Bill of Material (BOM) management is crucial for engineering teams, especially in the electronics industry. A well-managed BOM ensures that all components are accounted for, costs are controlled, and production timelines are met. This article explores essential BOM management tools and strategies that can enhance BOM management, making the process more efficient and reliable. Understanding the Importance of BOM Management A Bill of...

Welcome to the Ctrl+Listen Podcast, brought to you by Octopart! Join James and his guest, Carling Spelhaug, the Director of Communications at AMP, as they delve into the revolutionary impact of AI on the recycling industry. Listen to the Episode: Watch the Episode: Episode Highlights: AMP's Mission: How AMP is maximizing waste value The role of AI in automating waste sorting and improving efficiency. Materials Recovery Facilities (MRFs)...

The aerospace industry has an unquenchable thirst for new technologies that can improve craft performance and capabilities. This ongoing desire for more speed, less weight, better efficiency and new capabilities drives continual technological advancements in electronic components and aerospace design approaches.  From the smallest CubeSats to the largest airliners, the latest components are taking aerospace into a higher orbit. For example...

In the intricate process of PCB development, design is only one part of the equation. The surrounding documentation, component sourcing, and collaboration are just as crucial to ensure a smooth and successful project completion. While the design phase receives much attention, it's the often-overlooked areas that can make or break your project timeline and quality. Join our webinar to discover how Altium Designer empowers you to handle every...

Demand is no issue for silicon carbide (SiC) chip makers. The downstream dependence on these kinds of chips means this segment is now in a concrete position to increase output. Although, it’s likely the heavy hitters in this space—STMicroelectronics, Onsemi, Wolfspeed, and ROHM, and the like—have their attention closely pinned on emerging clean energy markets.  In recent years, we’ve learned that sustainable industries are heavily impacted by...

Supply chains are prone to challenges, particularly when it comes to acquiring technology, but it seems the more and more businesses attempt to bolster the fast-paced evolution of the industries, the harder it becomes to keep up with digitalization as a component HBM manufacturer.  The demand on parts makers has never been greater. As digital solutions form the backbone of society–as shown recently through the global impacts of the Microsoft...