The High-Speed PCB Stackup Design Challenge
As much as we would like to build every high speed PCB perfectly, with ideal SI/PI/EMI characteristics, it isn’t always possible due to many practical constraints. Sometimes a stackup can be “good enough,” even for a high-speed PCB. This always comes from the need to balance engineering constraints, functional requirements, and the need to ensure signal and power integrity in a high-speed design, and finally to ensure compliance with EMC...