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If you're an engineer or a sourcing professional, you’ve likely felt this pressure before: pick the right part, get it on time, stay under budget, make sure it works. The balance of cost, quality, and availability has always been a key consideration when selecting electronic components. However, in today's landscape, this balance has become arguably more challenging than ever to achieve, with the potential consequences of misjudgment more severe...

In an era when electronics are becoming more compact, powerful, and interconnected, complexity isn't just growing. It's compounding. Designers today aren’t just building single PCBs. They’re orchestrating full-blown electronic ecosystems where multiple boards must work in perfect harmony. Multi-board design is the new normal, whether it's a high-speed compute module connected to a power conversion board or a sensing PCB feeding into a...

The European Union's Medical Device Regulation (MDR), formally known as Regulation (EU) 2017/745, represents a significant shift in how medical devices are designed, developed, and brought to market. Implemented to enhance patient safety and improve product efficacy, the MDR enforces stricter oversight throughout the product lifecycle, from initial concept to post-market surveillance. For professionals in the medical electronics industry...

Are inefficient design reviews hindering your product development? Join our live webinar to learn how Altium 365 accelerates collaboration, standardizes workflows, and ensures design integrity to mitigate risks and accelerate time to market. What You’ll Learn: Eliminate Siloed Communication: Solve issues like scattered feedback and outdated design versions. Altium 365’s Smart Review Process: Increase efficiency by using centralized design...

If you’ve been working with HDI (High-Density Interconnect) technology, you’ve probably noticed that the industry is pushing the boundaries of what's possible. Traditional HDI designs have relied on laser-drilled microvias around 4 mils in size, with capture pad diameters typically 8–10 mils larger. But technology never stands still, and now Ultra HDI is taking things to a whole new level, redefining via structure and density in ways that were...

PCB designers are constantly facing the challenge of packing more functionality into smaller spaces while ensuring high performance. What was once used only for IC substrate and package fabrication, today Ultra HDI (Ultra High-Density Interconnect) technology is being brought to the PCB level to allow very high density routing capabilities. But what exactly makes Ultra HDI so powerful, and how does it elevate routing efficiency? More...

The Risks of Scaling Without BOM Validation Component costs and sourcing challenges increase during scale-up, leading to redesigns and reduced margins. How Part Analytics Supports Informed, Scalable Engineering Expose risk and cost factors across your full BOM Group parts and generate RFQs with less manual overhead Pinpoint verified alternates that meet spec without redesign  What You’ll Learn How to reduce production BOM costs without...

For engineers, component selection is far from a mundane step in the PCB design process. Decisions directly impact project success, reliability, resilience, and scalability. Companies that have shifted to proactive component selection anticipate supply-chain and geo risks, safeguard against supply chain disruptions, and optimize designs for higher quality and extended product lifecycles. Unfortunately, many technology manufacturing businesses...

The year is 2030. Your quantum-enhanced EDA software just simulated a new battery material at the molecular level – a job that used to take months, now done in half an hour. Across the room, your colleague uses a quantum-classical hybrid system to optimize a complex RF layout, simultaneously exploring millions of possible configurations. Meanwhile, your team's cryptography expert implements the latest quantum-resistant protocols to secure your...