Microvia Technology and Beyond for HDI Design
HDI PCBs, ultra-HDI, packaging, substrate-like PCBs, and highly advanced chip-on-board can all require microvia structures once electrical connections become very dense. In these designs, higher density chipsets and packages have driven the demand for more advanced fabrication capacity that can support microvias into advanced stackups. But in addition to microvias in standardized HDI stack ups, there are more advanced interconnects available for...