Competition for HDI: VeCS
Not long ago, a very creative engineer in Europe proposed a novel concept for layer-to-layer connections that has higher density than the conventional through-hole. That engineer is Joan Torne’ of NEXTGin Technologies BV [1] and his technology is called, “Vertical Conductive Structures-VeCS”. It employs the conventional PCB TH fab equipment, increases densities to that of HDI, with capabilities down to 0.4 mm pitch BGAs.
The concept is to peck...