About Author

Samer Aldhaher

A power electronics engineer with over 10 years of experience in the design, research, and development of high-speed switched-mode circuits. Samer Aldhaher specializes in wide-bandgap semiconductors (GaN & SiC) for high-power applications, including inverters, motor drives, PFC circuits and MHz wireless power. He is highly skilled in PCB design and layout optimization for fast switching, low inductance, low EMI, and thermal management. With hands-on experience in building and troubleshooting circuits, his work has led to 15 patents and 11 papers published in IEEE Journals.

Beyond his engineering expertise, Samer Aldhaher has a passion for 3D graphics and animation. In his free time, he explores the artistic side of electronics by creating detailed 3D renderings of electronics and circuit boards and visualising FMEA simulations. He uses his technical knowledge to craft visually accurate and aesthetically engaging models, bringing electronic systems to life in new and creative ways. His work bridges the gap between engineering and art, highlighting the intricate beauty of modern electronics.

Recent Articles

Wire Bonding in Altium Designer Introduction Wire bonding technology has evolved significantly over the years and so has its use cases and applications. As devices become more compact and powerful, designers need precise tools to handle complex interconnects, and Altium Designer has responded with capabilities that streamline wire bonding for Chip-on-Board (COB) designs, stacked dies in cavity, and other high-performance applications. This article explores the advanced wire Read Article

Wire Bonding: Modern Applications, Technology Trends and Cost Considerations Introduction Wire bonding has long been the dominant method for connecting semiconductor dies to package lead frames and circuit boards, particularly in Chip-on-Board (COB) technology, where the die is directly mounted onto the PCB. Wire bonding for COB became popular in consumer electronics, such as calculators and early digital devices due to its reliability and cost efficiency in mass production. Over time, wire bonding COB evolved to meet the Read Article