Alun Morgan Industry Keynote: PCB Base Material Properties and Developments

This presentation details the development of high reliability base materials for PCBs with a focus on thermal performance, reliability and signal integrity. Classification by application as a method of substrate selection will be explored. This methodology gives the designer the flexibility to select the appropriate substrate for an application without over engineering performance that is neither required nor can be afforded. The presentation includes a straightforward guide to the PCB substrate manufacturing process emphasizing the impact of resin chemistry, material reinforcement and copper foil properties on substrate performance.

View Alun Morgan's presentation slides or clips from his keynote below:

Alun Morgan On PCB Base Materials

Alun Morgan On PCB Base Material Reinforcements

Resin/Reinforcement Selection Considerations

Alun Morgan On The PCB Base Material Production Process

Alun Morgan On Thermoplastics, Thermosets, And Epoxy Resin

Alun Morgan On Epoxy Curing Chemistry

What Is Glass Transition Temperature?

The Effect Of Structure On Glass Transition Temperature

Alun Morgan On Lead-free Soldering

The Influence Of TG And Fillers On Thermal Expansion

Alun Morgan On Glass Fibre Production

Alun Morgan On The Effect Of Filament Distribution Inside Glass Fabrics

Alun Morgan On The Impedance Triangle

Alun Morgan On Electrical Loss And Dipole Moment

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