New PCB Assembly Method Promises Higher Reliability & Lower Cost

Zachariah Peterson
|  Created: September 30, 2025  |  Updated: January 18, 2026
New PCB Assembly Method Promises Higher Reliability & Lower Cost

Discover The Occam Group's process, a revolutionary approach to PCB assembly that eliminates solder while improving reliability, reducing costs, and simplifying manufacturing. Ray Rasmussen, Managing Partner at  The Occam Group, explains how this innovative methodology embeds components and builds copper-to-copper connections using existing fabrication equipment—no massive capital investment required.

Learn how the Occam opportunity could transform electronics manufacturing by offering embedded components, superior signal integrity, and a pathway for US fabricators to compete globally. From DoD testing to potential applications in high-density interconnect and semiconductor packaging, this conversation explores the future of PCB assembly and why industry leaders are taking notice.

Watch the Episode:

More Resources:

About Author

About Author

Zachariah Peterson has an extensive technical background in academia and industry. He currently provides research, design, and marketing services to companies in the electronics industry. Prior to working in the PCB industry, he taught at Portland State University and conducted research on random laser theory, materials, and stability. His background in scientific research spans topics in nanoparticle lasers, electronic and optoelectronic semiconductor devices, environmental sensors, and stochastics. His work has been published in over a dozen peer-reviewed journals and conference proceedings, and he has written 2500+ technical articles on PCB design for a number of companies. He is a member of IEEE Photonics Society, IEEE Electronics Packaging Society, American Physical Society, and the Printed Circuit Engineering Association (PCEA). He previously served as a voting member on the INCITS Quantum Computing Technical Advisory Committee working on technical standards for quantum electronics, and he currently serves on the IEEE P3186 Working Group focused on Port Interface Representing Photonic Signals Using SPICE-class Circuit Simulators.

Related Resources

Back to Home
Thank you, you are now subscribed to updates.