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Thought Leadership
How to Speed Up Your DFM Report View Process in the Cloud
Make sure your design will be produced with high quality and yield with our DFM report guidelines. You’ll want to perform DFM analysis at multiple stages during the design process.
Thought Leadership Engineering News
Antipad Diameter, Crosstalk, and IBM’s Results from IPC APEX EXPO 2021
Interlayer crosstalk begins with antipad diameters, and IBM’s results help us see how antipad diameter on back-drilled PTHs affect signal integrity.
RF Microstrips and Ground Plane Clearance: How Close is Too Close?
Make sure to account for microstrip ground clearance when using copper pour on the surface layer. We’ll examine what happens with microstrips, striplines, and coplanar waveguides.
How to Design Castellated Holes and Edges in a PCB for an SMD Module
Modules on small PCBs can be quickly surface-mounted to a carrier board with castellated holes. Here’s how you can design castellated edges.
Complete Guide to DFM Analysis
Make sure your design will be produced with high quality and yield with our DFM analysis guidelines. You’ll want to perform DFM analysis at multiple stages during the design process.
Thought Leadership
Wideband Signal Processing and Analysis in Ultra-high Speed PCB Design
Wideband signal analysis may seem like black magic, but it does more than create pretty graphs. Read our introduction to wideband signal analysis to learn more.
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