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Home Webinare Erschließen Sie neue Design-Möglichkeiten mit Drahtbonding

Erschließen Sie neue Design-Möglichkeiten mit Drahtbonding

Revolutionieren Sie Ihr PCB-Design und entdecken Sie, wie das Drahtbonding neue Möglichkeiten für Ihre Projekte bietet. In diesem Webinar erfahren Sie, wie das Drahtbonding Ihren Designprozess vereinfacht, indem es manuelle Arbeit oder externe Software überflüssig macht, damit Sie sich auf die Innovation konzentrieren können.

Das Drahtbonding bietet eindeutige Vorteile, wie z.•B. die Reduzierung der Designgröße, die Verbesserung des Power Managements und die Erhöhung der mechanischen Zuverlässigkeit. Durch die Nutzung dieser Vorteile können Sie effiziente Verbindungen und einen gestrafften Designprozess erreichen und gleichzeitig die Gesamtleistung und Beständigkeit Ihres Projekts steigern.

In diesem Webinar behandeln wir folgende Themen:

  • Einsatzmöglichkeiten und Vorteile des Drahtbondings
  • Praxisbeispiele, die die gesteigerte Effizienz des Designs verdeutlichen
  • Einblicke in die Optimierung Ihres Designprozesses für eine bessere Leistung

Fortschrittliche Designs mit Drahtbonding-Methoden, die die Leistung verbessern, Prozesse rationalisieren und dauerhafte Designintegrität bieten.

Wire bonding

Registration has recently closed. Check back soon for on-demand webinar.

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Erschließen Sie neue Design-Möglichkeiten mit Drahtbonding

Erstellt: October 2, 2024
9 videos
  • Präsentiert von Martin Malenica - Field Application Engineer
    00:19:38 • Oct 24, 2024
    Präsentiert von Martin Malenica - Field Application Engineer
    00:19:38 • Oct 24, 2024

    Fortschrittliche Designs mit Drahtbonding-Methoden, die die Leistung verbessern, Prozesse rationalisieren und dauerhafte Designintegrität bieten.

  • Hosted by Alex Hall - Technical Marketing Engineer
    00:34:01 • Oct 24, 2024
    Hosted by Alex Hall - Technical Marketing Engineer
    00:34:01 • Oct 24, 2024

    Take your designs to the next level with wire bonding methods that enhance performance, streamline processes, and provide lasting design integrity.

  • Hosted by Jan Grooten - Field Application Engineer
    00:50:17 • Oct 24, 2024
    Hosted by Jan Grooten - Field Application Engineer
    00:50:17 • Oct 24, 2024

    Take your designs to the next level with wire bonding methods that enhance performance, streamline processes, and provide lasting design integrity.

  • Hosted by Kunjal Patel - Field Application Engineer
    00:45:20 • Oct 24, 2024
    Hosted by Kunjal Patel - Field Application Engineer
    00:45:20 • Oct 24, 2024

    Take your designs to the next level with wire bonding methods that enhance performance, streamline processes, and provide lasting design integrity.

  • Hosted by Aida Gharahkhani - Field Application Engineer
    00:34:30 • Oct 23, 2024
    Hosted by Aida Gharahkhani - Field Application Engineer
    00:34:30 • Oct 23, 2024

    Take your designs to the next level with wire bonding methods that enhance performance, streamline processes, and provide lasting design integrity.

  • 오힘찬 FAE 발표
    00:27:47 • Oct 30, 2024
    오힘찬 FAE 발표
    00:27:47 • Oct 30, 2024

    성능을 향상하고 공정을 간소화하며 지속적인 설계 무결성을 제공하는 와이어 본딩 방법으로 설계를 한 단계 더 발전시키세요.

  • プレゼンター:ダニエル チョウ
    00:23:12 • Oct 24, 2024
    プレゼンター:ダニエル チョウ
    00:23:12 • Oct 24, 2024

    ワイヤボンディングによって、設計の強化、サイズの縮小、電力管理の改善、機械的信頼性の向上を実現する方法を確認しましょう。

  • Présenté par Nourhene Kerkeni - Field Application Engineer
    00:27:38 • Oct 24, 2024
    Présenté par Nourhene Kerkeni - Field Application Engineer
    00:27:38 • Oct 24, 2024

    Découvrez comment le câblage par fils peut améliorer vos conceptions, réduire leur taille, améliorer la gestion de l'énergie et augmenter la fiabilité mécanique.

  • Presentado por Victor Rodriguez Silva - Field Application Engineer
    00:26:13 • Oct 24, 2024
    Presentado por Victor Rodriguez Silva - Field Application Engineer
    00:26:13 • Oct 24, 2024

    Lleva tus diseños al siguiente nivel con las técnicas de unión de cables que mejoran el rendimiento, agilizan los procesos y proporcionan una integridad duradera al diseño.

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Revolutionieren Sie Ihr PCB-Design und entdecken Sie, wie das Drahtbonding neue Möglichkeiten für Ihre Projekte bietet. In diesem Webinar erfahren Sie, wie das Drahtbonding Ihren Designprozess vereinfacht, indem es manuelle Arbeit oder externe Software überflüssig macht, damit Sie sich auf die Innovation konzentrieren können.

Das Drahtbonding bietet eindeutige Vorteile, wie z.•B. die Reduzierung der Designgröße, die Verbesserung des Power Managements und die Erhöhung der mechanischen Zuverlässigkeit. Durch die Nutzung dieser Vorteile können Sie effiziente Verbindungen und einen gestrafften Designprozess erreichen und gleichzeitig die Gesamtleistung und Beständigkeit Ihres Projekts steigern.

In diesem Webinar behandeln wir folgende Themen:

  • Einsatzmöglichkeiten und Vorteile des Drahtbondings
  • Praxisbeispiele, die die gesteigerte Effizienz des Designs verdeutlichen
  • Einblicke in die Optimierung Ihres Designprozesses für eine bessere Leistung

Fortschrittliche Designs mit Drahtbonding-Methoden, die die Leistung verbessern, Prozesse rationalisieren und dauerhafte Designintegrität bieten.

Author

Author

Martin Malenica has a masters in electronic and computer engineering at the University of Zagreb. His previous experience consists of multiple embedded systems positions at robotics start-ups (Gideon with USD 35m in Seed and Series-A funding) and SMEs. His engineering strengths lie in system architecture, PCB design and embedded programming. Aside from engineering, Martin has spent the last 1.5 years working at a leading European management consulting firm, where he focused on strategies to support large OEMs and Tier-1s regarding the current semiconductor shortage across the whole EMEA region. Martin has practical experience within AD, but also a good understanding of competitor tools, especially on the procurement and supply chain side, like Everstream, Resilinc, Silicon Expert, Z2Data etc. Martin Joined Altium in 2023 as part of the Technical Sales team in Germany.
 

More content by Martin Malenica

Author

Author

Alex has a background in electrical engineering and a strong passion for technical marketing. Graduating with a bachelor’s in electrical engineering from Clemson University in 2018, he has since excelled in various roles within the technology sector. Starting his career at Kyocera AVX, Alex served as an RF Field Applications Engineer, establishing strong client relationships and designing passive bandpass filters and antenna systems. He then transitioned to TDK as an Account Executive, where he provided sales and technical support, leading a dynamic sales team and offering design assistance to customers. Currently, Alex is a Technical Marketing Engineer at Altium, leveraging his technical expertise to develop marketing materials.
 

More content by Alex Hall

Author

Author

Jan Grooten is an Electronics Design Engineer who graduated (MScEE) in Asic design at the University of Twente, Netherlands. Besides Altium, Jan’s work experience includes Ericcsson, Sony and Plantronics where he served as Electronic System Engineer with focus on product development for Bluetooth headsets, with specialisation in small Li-ion batteries and Power management IC's. Jan started his career at Altium in 2017 as Field Application Engineer and is a Certified Interconnect Designer by IPC Council.
 

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Author

Kunjal studied Electronic & Communication Engineering at university, and currently works as a Technical Application Engineer at Altium in the Altium Bangalore office in India. Kunjal has over 20 years of direct experience with IPC CID Certification as an Sr. PCB Designer in the Space industry, various design firms, PCB Fabrication, and assembly houses.

More content by Kunjal Patel

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Author

Aida works as a Technical Sales Engineer at Altium and is based in the Sydney, Australia office. Aida studied Electrical/Electronic Engineering and completed Master of Engineering (MEng) Field of Mechatronics, Robotics, and Automation Engineering from the University of Western Sydney (UWS). Aida also completed certificates in Microcontroller Programming, Project Management Principles and Practices Specialization from the university of UC Irvine California. Aida has experience as an Electrical Engineer, Business Development Manager, Project Manager, Operations Manager, most recently in the last 10 years prior to joining Altium working in Engineering Process improvement. The most important thing that she always focuses on in her career is communication and trust. Aida strongly believes that communication is the solvent of all problems, when the trust accountability is high, communication is easy, instant, and effective.

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Author

Aiden은 대학에서 전자공학을 전공하였으며 PCB 설계 분야의 R&D로 7년 이상의 경험을 가지고 있습니다. 그는 전자 제품을 위한 SMPS, 인버터, 컨버터 설계 경험이 있습니다. 제품 프로젝트를 이끌었으며 설계, 관리, 인증 제품 테스트와 같은 모든 작업을 경험했습니다. 그리고 한국 리셀러(Hancom Intelligence) 팀에서 4년 이상 Altium Designer 사용자들을 위한 기술 지원 및 교육을 제공했습니다. Concord Pro와 Altium 365를 사용하여 PLM 요구 사항에 대한 컨설팅 및 지원을 했습니다. 또한 Altium Designer에 대한 수십 차례의 교육 및 웨비나를 경험했습니다.
Aiden은 2022년 11월부터 Altium에서 기술 영업 엔지니어로 근무하고 있으며 현재 한국 사무소에 근무하고 있습니다.

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Author

Daniel joined Altium in 2019 as an Application engineer and moved into the Technical Sales role in the same year. Daniel provides technical assistance for sales, third party distributors, and customers in the Asia Pacific region (APAC) and is based in the Altium Tokyo, Japan office. Daniel has experience with PCB,  FPGA, and ASIC design in telecommunication and Information industries. 
 

More content by Daniel Cho

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Author

Nourhene is an Electronic Engineer specializing in PCB Design and FPGA Programming, holding a Master’s degree in RFID technologies. Since joining Altium in 2019, she has partnered closely with the sales team to support both prospects and existing customers through technical sales and marketing initiatives across Altium’s portfolio.

Before Altium, Nourhene designed complex PCBs for Automotive and Aerospace applications at large international companies, where she also managed comprehensive testing processes. She has extensive experience collaborating with PCB manufacturers across Europe and Asia. Nourhene holds CID certification and is a certified Altium Designer Trainer.

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Author

Author

Victor is a Field Applications Engineer (FAE) at Altium, where he combines technical expertise with a customer-centric approach. With over 10 years of developing electronics for the automotive and railway industry and two years of experience as a dedicated 3D-Electronics application engineer, establishing strong client relations within the EMEA and North American market. His primary focus is to ensure customer satisfaction by providing simple solutions to the customer's complex problems.

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40:03 Lassen Sie sich durch mehrere ECAD-Dateiformate nicht bei der Markteinführung ausbremsen! Altium 365 Multi-CAD-Unterstützung Schauen Sie sich das Webinar an und erfahren Sie, wie Sie ECAD-Datensilos entfernen, um die Designzusammenarbeit zu verbessern, alle Ihre Video anschauen
24:31 Entdecken Sie die Vorteile der Versionskontrolle von Altium 365 für Einzeldesigner mit Ari Mahpour Sind Sie ein alleinstehender Elektronikdesigner oder Ingenieur, der seinen Entwurfsprozess optimieren und die Produktivität steigern möchte? Wir laden Sie zu Video anschauen
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Vorbereitung der Dateien für die Freigabe an die Fertigung Sehen Sie sich unser Webinar zum Thema „Vorbereitung der Dateien für die Freigabe an die Fertigung“ an. Hier klicken. Video anschauen
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46:34 2019-12-04 - AD20 What's New - IT - Webinar - EMEA - ADSCVid Video anschauen

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