How 5G and 6G Are Driving The Next Generation of Components

The rollout of 5G networks has already pushed electronic components to new limits. Now, with 6G on the horizon, engineers are entering an era where gigahertz (GHz) no longer stretch far enough. Sub-terahertz (Sub-THz) frequencies, ultra-low latency and bandwidths in the hundreds of gigahertz are all driving a new wave of innovation in devices, networks and within the components themselves.

For electronics engineers, this is a tectonic realignment in how RF front ends, antennas, chipsets and PCBs are designed. Whether you’re prototyping a next-gen IoT device or building the RF chain for an autonomous vehicle, 5G and 6G are changing the rules. While 6G standards are still taking shape, today’s components already offer clear directional signals about where wireless technology is headed.

What 5G Taught Us and What 6G Demands

While 5G is still rolling out globally, it’s already changed how engineers design RF systems. Since deployments began in 2019, 5G has introduced wider spectrum use, Massive MIMO (multiple-input, multiple-output) and dual operation across sub-6 GHz and mmWave bands, expanding both performance and complexity. The current 5G-Advanced phase (Release 18 and beyond) builds on that with AI-driven beam management, enhanced positioning and improved energy efficiency, all of which push components harder than ever.

6G is on the horizon, with commercial rollout expected around 2030. Early prototypes are already exploring sub-terahertz frequencies (100–300 GHz), data rates over 100 Gbps and latencies under 0.1 ms. Beyond speed, 6G is about convergence. Future networks will integrate communications with sensing, localization and intelligent surfaces. For component engineers, that means designing for extreme frequencies, tighter integration and real-time adaptability before the standard takes shape.

More Bands, More Complexity, More Heat

Today’s 5G devices operate across more bands than 4G, including the C-band (~3.5 GHz) and mmWave ranges like 28 and 39 GHz. That means more antennas, power amplifiers, LNAs and filters, all squeezed into ever-smaller form factors. And with 6G targeting frequencies from 100 to 300 GHz, the pressure on thermal, layout and RF performance will continue to grow.

A 5G smartphone may support a dozen bands with MIMO streams and discrete mmWave modules. Each adds new RF tuning challenges, heat loads and board-level compromises. In response, component suppliers are moving to tighter integration, tunable architectures and advanced packaging. This shifts traditional board-based designs to antenna-in-package (AiP) and system-in-package (SiP) configurations.

Meet the Components Powering the 5G to 6G Shift

To meet these rising demands, component innovation has surged. Below are eight standouts that are closing the gap between ambition and implementation.

1. Qualcomm Snapdragon X75 5G Modem-RF System

Qualcomm’s X75 is the first commercial modem designed to support 5G Release 18 (5G-Advanced). It includes a dedicated AI tensor accelerator that optimizes beamforming, antenna tuning and RF power paths in real time. The system supports both sub-6 GHz and mmWave, pairing with Qualcomm’s QTM565 antenna modules for a fully integrated stack. This level of real-time, on-device intelligence sets the tone for 6G design philosophies.

2. Nanusens MEMS Digitally Tunable Capacitors (DTCs)

Nanusens has developed MEMS-based DTCs that can be embedded in RF front ends to enable dynamic antenna tuning across multiple GHz bands. Built in standard CMOS, these high-Q capacitors will reduce RF losses, improve antenna efficiency and extend battery life.

3. UMC Hybrid-Bonded RF-SOI Stack (RF Die Stacking Platform)

UMC’s hybrid bonding technology for RF silicon-on-insulator (RF-SOI) enables stacking two active RF dies with nearly zero interconnect height, cutting module area and preserving high-frequency performance. Originally deployed on 55 nm nodes for 5G front ends, it’s now being extended to 40 nm and refined for future 6G bands. The technology supports denser multi-function RF modules with better thermal performance and lower loss.

4. Analog Devices ADRV904x Transceiver Series

The ADRV904x family of quad-channel RF transceivers for 5G base stations supports frequency coverage from 650 MHz to 6 GHz and integrates four transmit and receive paths along with DSP blocks, mixers and data converters. It simplifies massive MIMO design for 5G base stations and paves the way for future 7 GHz+ use in 6G deployments. Built-in features like digital predistortion (DPD) and advanced filtering reduce reliance on external RF blocks.

5. Qorvo QPB9329 Switch LNA Module

Qorvo’s QPB9329 is a dual-channel switch low-noise amplifier (LNA) module designed for TDD-based 5G massive MIMO systems and small cells. Operating across 3.8 to 5.0 GHz, it integrates a high-power SOI switch with a two-stage LNA and supports up to 8W average input power. This level of integration reduces board space and simplifies the RF chain for high-density deployments. With low noise figure, bypass mode and compact packaging, it’s a strong fit for mid-band 5G radios requiring efficient receive path performance.

6. pSemi PE562212 Multi-Protocol Integrated FEM

pSemi’s PE562212 is a compact 2.4 GHz front-end module built for Thread, Zigbee, Bluetooth and low-to-medium throughput Wi-Fi IoT applications. It integrates a power amplifier, low-noise amplifier and bypassable switch into a 1.8 × 1.8 mm LGA package. Designed on pSemi’s UltraCMOS SOI process, the module delivers up to +21 dBm output power and supports smart speakers, wearables and connected home devices.

7. Samsung Dual-Band Compact Macro Radio Units

Samsung’s Compact Macro radio units integrate baseband, radio and antenna into a single enclosure, supporting both 28 GHz and 39 GHz bands. These units incorporate over 1,000 antenna elements, enabling precise beamforming and are deployed in dense urban 5G networks. 

8. Qualcomm Advanced 6G Research Platforms

Qualcomm’s latest 6G research highlights real-world progress toward next-generation wireless. At MWC Barcelona 2024, the company showcased a Giga-MIMO prototype operating at 13 GHz, with point-to-multipoint sub-THz links at 140 GHz and a digital twin network testbed designed to enhance prediction, positioning and RF optimization. Together with AI-based beam management and mmWave repeaters, these testbeds show how Qualcomm is shaping next-gen wireless architecture.

Antennas, Packaging, and the Power Problem

AiP designs are now standard in mmWave smartphones and increasingly common in infrastructure gear. By embedding antennas directly into the package, often above or alongside the RFIC, signal loss is minimized and overall form factor is reduced. 

For example, Qualcomm’s QTM565 module is a fifth-generation mmWave antenna-in-package solution designed to support up to 1000 MHz of bandwidth across global mmWave bands. Paired with the Snapdragon X75 or Snapdragon X72 modem-RF systems, it enables Qualcomm’s converged sub-6 GHz and mmWave architecture, optimizing performance and power efficiency in next-gen mobile devices.

At sub-THz, lensed antennas, metasurfaces and wafer-scale arrays are entering prototype phases. All of these systems share a common enemy: heat. GaN PAs, stacked dies and high-speed interconnects generate significant thermal loads. Packaging now includes ceramic substrates, copper coins and even diamond composites in advanced use cases to manage thermals.

PCB Design Has Become an RF Discipline

Routing RF at mmWave requires 5G hardware designers to use low-loss laminates, like Liquid Crystal Polymer (LCP) and Rogers Polytetrafluoroethylene (PTFE), for key interconnects. In 6G prototypes, glass interposers and additive 3D waveguide structures are replacing traditional traces entirely. PCB engineers must now consider impedance control, coupling, shielding and heat, often in tandem with the RF and mechanical teams.

Designing Today with 6G in Sight

The 6G vision includes terabit speeds, microsecond latencies, precision sensing and adaptive AI-driven RF. All of these elements are now taking shape in today’s components. Commercial readiness may be years away, but the building blocks are here. Choosing components that are 5G-Advanced ready or part of early 6G integration paths is a design decision that will determine what your device can do and how long it stays relevant.