Basic Wireless Design with RF Modules - Wilson

This page takes a look at defining the stackup for your board using the Layer Stack Manager. It covers topics including layer properties and materials, symmetry and rigid-flex sub-stacks

This page looks at the PCB Editor's support for via stitching (used to tie together larger copper areas on different layers) and via shielding (used to help reduce crosstalk and electromagnetic interference in a route that is carrying an RF signal)

This page looks at the PCB Editor's support for printed electronics - the ability to print the electronic circuit directly onto a substrate, such as a plastic molding that becomes a part of the product