PCB Layer Stack Up

Created: January 18, 2019
Updated: March 20, 2020

Download the PDF to keep learning offline

most recent articles

PCB Testing 101: Important Methods and Metrics PCB testing must occur during fabrication, assembly, and board bring-up. Here’s how you can plan to be successful during testing and inspection. Read Article

What Goes Into Rugged Electronics Design? In this article, we’ll outline some of the common design decisions that go into rugged electronics, as well as some steps you can take to create rugged PCBAs. Read Article

Getting Started with Design Rules and Constraints Getting started with design rules can sometimes be a difficult task, but it doesn’t have to be. A proper structure Watch Video

Reduce CM Noise in Your Power Supply with Impedance Balancing You can use impedance balancing to reduce conducted common-mode noise in your power supply. Here’s how it works and some experimental results. Read Article

Using Altium 365 for Sharing Simulations in the Cloud Altium 365 allows you to share your cloud simulation models and data with your signal integrity team and test engineer. Read Article

Component Shortages Report from IHS What are the coping strategies available for PCB Designers to face the challenging impact of component shortages in the industry? Watch and learn in this episode with expert Greg Wood of IHS. Read Article

New Dimensions of PCB Simulation Judy Warner: What was the technology impetus behind forming Avishtech as a company? Keshav Amla: The simple answer is that we saw some major pain points in the existing electronics design and development approach, relating to signal integrity, manufacturability and reliability of PCBs. As far as signal integrity, loss modeling was a source of major consternation, but an even bigger cause for concern was the inability to predict manufacturability Read Article

How to Speed Up Your DFM Report Process in the Cloud Make sure your design will be produced with high quality and yield with our DFM analysis guidelines. You’ll want to perform DFM analysis at multiple stages during the design process. Read Article

Antipad Diameter, Crosstalk, and IBM’s Results from IPC APEX EXPO 2021 Interlayer crosstalk begins with antipad diameters, and IBM’s results help us see how antipad diameter on back-drilled PTHs affect signal integrity. Read Article

Microstrip Ground Clearance: How Close is Too Close? Make sure to account for microstrip ground clearance when using copper pour on the surface layer. We’ll examine what happens with microstrips, striplines, and coplanar waveguides. Read Article

Back to Home