Unleashing your High Density PCB Designs

Judy Warner
|  Created: May 18, 2021
Unleashing your High Density PCB Designs

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Show Highlights:

  • Understanding Semi Additive Process (SAP) and Modified Semi Additive Process (MSAP)
  • MSAP isn’t new, but it’s growing to adoption, what’s driving that?
  • What makes MSAP especially applicable now?
  • Benefits of Laser Direct Imaging (LDI) for PCB designers and manufacturers
    • What are the design implications and benefits? What exactly can you do with it?
  • The methods/materials used for this technology?
    • Chemical Technology, Averatec
    • Ultra-thin copper, Insulectro

Links and Resources:

Insulectro Webinar on MSAP
Insulectro Website
(Insulectro Webinars Library available near the bottom of their homepage)
Chris Hunrath LinkedIn profile
Averatek Podcast on Additive Manufacturing

 

Altium 365: Where the World Designs Electronics

About Author

About Author

Judy Warner has held a unique variety of roles in the electronics industry for over 25 years. She has a background in PCB Manufacturing, RF and Microwave PCBs and Contract Manufacturing, focusing on Mil/Aero applications. 

She has also been a writer, blogger, and journalist for several industry publications such as Microwave Journal, PCB007 Magazine, PCB Design007, PCD&F, and IEEE Microwave Magazine, and an active board member for PCEA (Printed Circuit Engineering Association). In 2017, Warner joined Altium as the Director of Community Engagement. In addition to hosting the OnTrack Podcast and creating the OnTrack Newsletter, she launched Altium's annual user conference, AltiumLive. Warner's passion is to provide resources, support, and advocate for PCB Design Engineers worldwide.

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