In today’s OnTrack Podcast Judy talks to Mike Vinson, the COO of Averatek about their breakthrough innovation in which they use a semi-additive process incorporating a liquid metal ink as the catalyst seed layer. This special catalytic precursor “ink” can be imaged to create the patterns or areas where conducting metal is to be deposited. This ink controls the horizontal dimensions of line width and spacing and creates the ability to get down to 1 mm and sub-1 mm line and traces. Keep an eye on this technology!
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Email: mike@averatek.com
Implement any kind of layer stack for both rigid and rigid-flex PCBs.
Preview to Apex - this was both Mina and SAP and mSAP focused
Additive Electronics PCB Scale to IC Scale
Flex Circuit Firsts - mentioned Averatek
Medical research is Golden - additive process and gold conductors
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Judy Warner has held a unique variety of roles in the electronics industry for over 25 years. She has a background in PCB Manufacturing, RF and Microwave PCBs and Contract Manufacturing, focusing on Mil/Aero applications.
She has also been a writer, blogger, and journalist for several industry publications such as Microwave Journal, PCB007 Magazine, PCB Design007, PCD&F, and IEEE Microwave Magazine, and an active board member for PCEA (Printed Circuit Engineering Association). In 2017, Warner joined Altium as the Director of Community Engagement. In addition to hosting the OnTrack Podcast and creating the OnTrack Newsletter, she launched Altium's annual user conference, AltiumLive. Warner's passion is to provide resources, support, and advocate for PCB Design Engineers worldwide.
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