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Learning Hub Webinars Eliminate Your Design Friction with Agile Teams

Eliminate Your Design Friction with Agile Teams

Discover how Agile Teams improves collaboration, synchronization, and delivery across your design process.

Modern PCB design often struggles with inconsistent project structures, serialized design workflows, ECAD-MCAD disconnects, and unorganized release practices. These challenges create avoidable rework, slow iterations, and introduce unnecessary manufacturing risk. Join us for a practical look at the design capabilities within Agile Teams, where structured project governance establishes stable design foundations, collaborative workflows enable efficient multi-designer development, cross-domain integration reduces electromechanical friction, and controlled release processes deliver validated, traceable manufacturing outputs, all working together to accelerate design and improve delivery confidence.

What You'll Learn

Establish structured design foundations with managed projects: Create managed projects inside the Workspace to introduce consistency, governance, and a shared source of truth from the start, preventing downstream workflow chaos and misalignment.
Enable multi-designer PCB workflows: Leverage PCB Co-Authoring to support concurrent layout activities, improve change awareness, and eliminate bottlenecks caused by serialized design approaches.
Eliminate ECAD-MCAD friction through synchronization: Synchronize electrical and mechanical domains to align geometry, constraints, and intent, removing reliance on STEP files while surfacing electromechanical conflicts earlier.
Deliver controlled, traceable manufacturing outputs: Use Managed Release workflows to generate validated, revision-locked outputs that improve traceability, reduce manufacturing risk, and increase release consistency.

Why Attend?

See how structured project foundations reduce workflow chaos, version drift, and downstream rework
Understand how concurrent design collaboration eliminates bottlenecks and improves team efficiency
Learn how cross-domain synchronization surfaces electromechanical issues earlier and reduces integration friction
Discover how controlled release processes improve traceability, validation, and manufacturing confidence
Ask questions directly to experts during the live Q&A session

Who Should Attend?

PCB Designers & Electronics Engineers seeking faster design iterations, reduced workflow bottlenecks, and improved design visibility.
Mechanical Engineers requiring reliable geometry synchronization and earlier validation of fit, constraints, and board interactions.
System Engineers / Architects needing system-level alignment across boards, assemblies, and mechanical context.
Manufacturing Engineers focused on reducing release errors, improving output consistency, and minimizing downstream surprises.
Engineering Managers & Team Leads looking to improve workflow predictability, reduce rework, and scale cross-disciplinary collaboration.
Any hardware team experiencing workflow friction, version conflicts, or release inconsistencies

Reserve Your Spot

Don’t miss this opportunity to see how Agile Teams can help you build speed, structure, and flexibility into every stage of your product development.

Space is limited—secure your spot today and take the next step in connected electronics design!

Registration has recently closed. Check back soon for on-demand webinar.

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Collaborative product development between the Electronic and Mechanical design domains brings unique challenges. Today, most companies are still using a file-based methodology (STEP, IDF, DXF, IDX) for creating and exchanging data between the two domains. This, for the most part, requires that the entire database is exchanged multiple times, resulting in README files, marked-up PDF’s and in-person meetings to review the updates and ensure they

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Eliminate Your Design Friction with Agile Teams

Created: February 24, 2026

At a Glance

Discover how Agile Teams improves collaboration, synchronization, and delivery across your design process.

Go Deeper with AI:

5 videos

Hosted by Alex Hall - Product Marketing Engineer

00:22:21 • Mar 11, 2026

Hosted by Alex Hall - Product Marketing Engineer

00:22:21 • Mar 11, 2026

Discover how Agile Teams improves collaboration, synchronization, and delivery across your design process.
Présenté par Majdi Thouabtia - Field Application Engineer

00:18:45 • Mar 12, 2026

Présenté par Majdi Thouabtia - Field Application Engineer

00:18:45 • Mar 12, 2026

Découvrez comment améliorer la collaboration, la synchronisation et la livraison tout au long de votre processus de conception grâce à Agile Teams.
Präsentiert von Martin Malenica - Field Application Engineer

00:20:36 • Mar 12, 2026

Präsentiert von Martin Malenica - Field Application Engineer

00:20:36 • Mar 12, 2026

Entdecken Sie, wie Agile Teams die Kollaboration, Synchronisation und Umsetzung in Ihrem Designprozess verbessert.
Presentato da Simone Marchetti - Field Application Engineer

00:42:32 • Mar 12, 2026

Presentato da Simone Marchetti - Field Application Engineer

00:42:32 • Mar 12, 2026

Scopri come Agile Teams migliora la collaborazione, la sincronizzazione e la consegna lungo tutto il processo di progettazione.
Presentado por Carlos Rodriguez Fuente - Field Application Engineer

00:25:17 • Mar 12, 2026

Presentado por Carlos Rodriguez Fuente - Field Application Engineer

00:25:17 • Mar 12, 2026

Descubre cómo Agile Teams mejora la colaboración, la sincronización y la entrega en tu proceso de diseño.

Product: Altium Agile Teams Webinars PCB Design Engineers PCB Design PCB Design and Layout

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Discover how Agile Teams improves collaboration, synchronization, and delivery across your design process.

What You'll Learn

Establish structured design foundations with managed projects: Create managed projects inside the Workspace to introduce consistency, governance, and a shared source of truth from the start, preventing downstream workflow chaos and misalignment.
Enable multi-designer PCB workflows: Leverage PCB Co-Authoring to support concurrent layout activities, improve change awareness, and eliminate bottlenecks caused by serialized design approaches.
Eliminate ECAD-MCAD friction through synchronization: Synchronize electrical and mechanical domains to align geometry, constraints, and intent, removing reliance on STEP files while surfacing electromechanical conflicts earlier.
Deliver controlled, traceable manufacturing outputs: Use Managed Release workflows to generate validated, revision-locked outputs that improve traceability, reduce manufacturing risk, and increase release consistency.

Why Attend?

See how structured project foundations reduce workflow chaos, version drift, and downstream rework
Understand how concurrent design collaboration eliminates bottlenecks and improves team efficiency
Learn how cross-domain synchronization surfaces electromechanical issues earlier and reduces integration friction
Discover how controlled release processes improve traceability, validation, and manufacturing confidence
Ask questions directly to experts during the live Q&A session

Who Should Attend?

PCB Designers & Electronics Engineers seeking faster design iterations, reduced workflow bottlenecks, and improved design visibility.
Mechanical Engineers requiring reliable geometry synchronization and earlier validation of fit, constraints, and board interactions.
System Engineers / Architects needing system-level alignment across boards, assemblies, and mechanical context.
Manufacturing Engineers focused on reducing release errors, improving output consistency, and minimizing downstream surprises.
Engineering Managers & Team Leads looking to improve workflow predictability, reduce rework, and scale cross-disciplinary collaboration.
Any hardware team experiencing workflow friction, version conflicts, or release inconsistencies

Author

Alex has a background in electrical engineering and a strong passion for technical marketing. Graduating with a bachelor’s in electrical engineering from Clemson University in 2018, he has since excelled in various roles within the technology sector. Starting his career at Kyocera AVX, Alex served as an RF Field Applications Engineer, establishing strong client relationships and designing passive bandpass filters and antenna systems. He then transitioned to TDK as an Account Executive, where he provided sales and technical support, leading a dynamic sales team and offering design assistance to customers. Currently, Alex is a Technical Marketing Engineer at Altium, leveraging his technical expertise to develop marketing materials.

Author

Majdi Thouabtia’s background is in electrical engineering, with several years of experience in hardware development and technical project management. He has worked across the full hardware lifecycle, from EMC-compliant circuit design and PCB layout to prototyping, testing, and production. Throughout my career, Altium Designer has been a key tool in his daily work, so he is especially proud to now be part of the team behind it.

Before joining Altium, he contributed to projects in the EV charging and IoT sectors, leading development efforts and collaborating with cross-functional teams and external partners. He holds a Master’s degree in Electrical Engineering from FAU Erlangen-Nürnberg.

Author

Martin Malenica has a masters in electronic and computer engineering at the University of Zagreb. His previous experience consists of multiple embedded systems positions at robotics start-ups (Gideon with USD 35m in Seed and Series-A funding) and SMEs. His engineering strengths lie in system architecture, PCB design and embedded programming. Aside from engineering, Martin has spent the last 1.5 years working at a leading European management consulting firm, where he focused on strategies to support large OEMs and Tier-1s regarding the current semiconductor shortage across the whole EMEA region. Martin has practical experience within AD, but also a good understanding of competitor tools, especially on the procurement and supply chain side, like Everstream, Resilinc, Silicon Expert, Z2Data etc. Martin Joined Altium in 2023 as part of the Technical Sales team in Germany.

Author

Simone joined Altium in 2018 as a Technical Sales Engineer and works closely with the sales team, taking care of both prospects and existing customers, supporting them with technical sales and marketing activities on Altium's products and services. He earned the Degree in Telecommunication Engineering at the University of Pisa (Italy). Simone started working in several sectors, from IT/networking, wireless and satellite communications and mechanical industries, where he gained more than 10 years experience in both Pre-Sales and Post-Sales technical support.