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Continuing our discussion on PCB design education, in this episode, joining us is Fergus Downey. Fergus is a Ph.D. student and research assistant at Curtin University in Western Australia (WA) and is currently involved in the Binar Space Program. Today, we will tackle the education and opportunities related to Mechatronic Engineering and a little overview of CubeSat. Listen to the Podcast: Download this episode (right click and save) Watch...

In today's business age, implementing a transformative digitalization strategy is one of the big keys to a company's ongoing and future success. By adopting and integrating digital platforms, smart applications, and managed services, businesses can transform business processes and product development. Why Startups Should Embrace Digitalization Digitalization allows companies to quickly adapt to changing market dynamics and customer expectations...

This track is for the designer who is new to high-speed layout and routing practices and wants to understand how they relate to signal integrity, and how to get started designing for high-speed digital applications. Slides From Presentation Stackups - material selection, planning the stack-up to support routing How to design stack-ups to balance impedance, power, and ground Different types of interconnects supported in Altium Designer...

Once you’ve run out of room on your 4-layer PCB, it’s time to graduate to a 6-layer board. The additional layer can give you room for more signals, an additional plane pair, or a mix of conductors. How you use these extra layers is less important than how you arrange them in the PCB stackup, as well as how you route on a 6-layer PCB. If you’ve never used a 6-layer board stackup before, or you’ve had EMI troubles with this stackup that are...

One of the longest-running myths in signal integrity is the requirement to eliminate 90° turns in PCB traces. As time has gone on, the god-of-the-gaps phenomenon has taken over; the myth has gone from unfounded and has steadily been pushed off to higher frequencies. The myth is based on a complete misunderstanding of how charges and fields interact in conductors and dielectric materials, so a deeper understanding of the basic physics leads one to...

This track is for the designer who is new to high-speed layout and routing practices and wants to understand how they relate to signal integrity, and how to get started designing for high-speed digital applications. Slides From Presentation Stackups - material selection, planning the stack-up to support routing How to design stack-ups to balance impedance, power, and ground Different types of interconnects supported in Altium Designer...

In this episode, we will talk about the importance of engaging and exposing the PCB Design students to today’s real-world industry demands. Our guest Sid Deliwala is the Director of Lab Programs in the Electrical and Systems Engineering Department at the University of Pennsylvania. Sid will share with us how he makes Electrical and Computer Engineering (ECE) fun and meaningful for our future innovators. Listen to the Podcast: Download this...

Currently, the standard packaging for housing a variety of advanced multifunctional semiconductor devices like FPGAs and microprocessors is the Ball Grid Array (BGA). Components in BGA packages are used in a huge range of embedded designs, either as host processors or as peripherals like memories. BGAs have evolved significantly over the years to keep up with technological progression of chip manufacturers, and variations of BGA packages are...

In this episode, we are very pleased to have Dr. Rob Spalding. He is a retired Brigade General at the US Air Force and now the CEO of SEMPRE (Secure EMP-Resistant Edge), a tech company based in Washinton DC that provides military-grade 5G and high-performance edge computing infrastructure for telecom operators, first responders, government, and enterprise customers. Today, Rob and I will talk about all things security! Rob will tackle the...