Designing for the Heat: Thermal Management in Collaborative PCB Workflows
PCB Design EngineersWhen electronic systems fail, heat is often the silent culprit. It creeps into power modules, sneaks behind display glass, and settles into datacenter racks with quiet intensity, gradually building up until it causes performance issues, component degradation, or even system failure. As devices become more compact and more capable, managing that heat has become a common thread that connects every design decision in modern PCB development.
Thermal...