Microvia Reliability in Ultra-High Density Interconnect Designs
Judy Warner: Early this year, we had the opportunity to meet at IPC Apex in California. In our conversation, you talked about the pervasive issue of microvia reliability. Will you please describe the issue for our readers?
Jim Brown: Judy, as the demand for technology has increased, it has trickled down to PCB density. The result is Ultra-HDI, stacked microvias, and sub-75-micron lines. Microvias have been in use for well over a decade but...