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Welcome to a new installment of the Pi.MX8 open-source computer module project! In this series, we delve into the design and testing of a system-on-module based on an i.MX8M plus processor from NXP. In the previous update, we completed the layout preparations. This included creating the impedance profiles, adding the design rules according to the board manufacturer specifications and defining areas where special design rules should apply. We...

Explore the fascinating evolution of signal integrity in PCB design with industry expert Donald Telian. In this episode of the Altium OnTrack podcast, Donald delves into the differences between modern and old school signal integrity, sharing invaluable insights from his illustrious career. Learn about IBIS modeling, high-speed design, and the critical advancements that have shaped the industry. Listen to the Episode: Watch the Episode: Epi...

In the fast-paced world of electronics design, Altium Designer shines as a leader in innovation, constantly pushing the limits of what's possible in PCB (Printed Circuit Board) design. Renowned for its comprehensive and easy-to-use tools, Altium Designer has consistently introduced cutting-edge features that meet the growing needs of engineers and designers around the globe. Among its many advancements, three stand out as especially innovative...

I would venture to guess that the most popular type of filter circuit I encounter in PCB designs and schematics is a pi filter, specifically a doubly terminated passive Butterworth pi filter. A pi filter circuit made from L and C elements can be easily scaled up to higher-order filtering. These filter circuits are also very easy to simulate, and the results are straightforward to interpret. Whether for a simple EMI solution or a filter on an...

A quick and easy way to get your circuit board into volume production is to use a fabrication house with a standard stackup. This is a very common approach in PCB prototyping and can also be used when producing at volume. A standard stackup is an entry-level configuration that a designer can use if they don't have the time or expertise to choose materials and layer thicknesses. PCB fabrication houses typically have their standard stackups that...

The next time you decide to use a BGA package in your PCB, it might require laser-drilled blind and buried vias. A new designer may find blind and buried vias usage to be complex, but never fear a little complexity. We compiled essential resources you'll need to use blind and buried vias successfully in an HDI PCB. Blind and buried vias are not new technology; they have been around since the advent of integrated circuit substrates used in many...

  When vias and plated through-holes are fabricated in a PCB, they require a metal deposition and plating process in order to build up the required copper on the hole wall. Building up the metal film on a via wall is performed with a process known as electroplating, but before this process is performed a primary metallization process is needed to form a seed layer for further deposition. There are primary metallization processes that can be used...

A PCB prototype isn't just a test device; even prototypes can be very revealing of intellectual property (IP). PCB prototypes give a glimpse of your product's intended functionality. Even minor details like the materials used for fabrication or the circuit board layer stack construction can be clues to a product's end-use application. The bill of materials (BOM) can provide more clues to a product's end-use application, especially if certain...