PCB de múltiples capas y la capa stackup

Vea nuestra colección de recursos para aprender más sobre el diseño de PCB de múltiples capas y capas stackup

Altium's Solutions for PCB Layer Stackup Tips for Layer Stack PCB Stackup Basics Layer Stack Documentation

Technical Documentation Definición de la pila de capas en Altium Designer The PCB is designed and formed as a stack of layers. In the early days of printed circuit board (PCB) manufacturing, the board was simply an insulating core layer clad with a thin layer of copper on one or both sides. Connections are formed in the copper layer(s) as conductive traces by etching away (removing) unwanted copper. Fast forward to today, where almost all PCB designs have multiple…

Technical Documentation Defining Blind, Buried & Micro Vias in Altium Designer The Role of the Via Vias are used to create the vertical, or layer-to-layer connections in a printed circuit board. In the early days of board fabrication, all of the vias passed all the way through the board, from one side to the other. These thru-hole vias are drilled after the layers are fabricated and the routing etched. The conductive via barrels are formed in the drilled holes using an…