Lleva tus diseños al siguiente nivel con las técnicas de unión de cables que mejoran el rendimiento, agilizan los procesos y proporcionan una integridad duradera al diseño.
Revoluciona tu enfoque de diseño de PCB y descubre de qué forma puede la unión por hilo aportar nuevas capacidades a tus proyectos. Este webinar te mostrará de qué manera la técnica de la unión de cables, también conocida como el wire bonding, simplifica tu proceso de diseño, eliminando la necesidad de trabajo manual o software externo, lo que te permite centrarte en la innovación.
La unión de cables ofrece distintas ventajas, como reducir el tamaño de tu diseño, mejorar la gestión de la energía y aumentar la fiabilidad mecánica. Aprovechando estas ventajas, conseguirás conexiones eficientes y un proceso de diseño racionalizado, lo que se traducirá en una optimización general del rendimiento y una mejor durabilidad de tu proyecto.
Acompáñanos para:
Lleva tus diseños al siguiente nivel con las técnicas de unión de cables que mejoran el rendimiento, agilizan los procesos y proporcionan una integridad duradera al diseño.
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Lleva tus diseños al siguiente nivel con las técnicas de unión de cables que mejoran el rendimiento, agilizan los procesos y proporcionan una integridad duradera al diseño.
Take your designs to the next level with wire bonding methods that enhance performance, streamline processes, and provide lasting design integrity.
Take your designs to the next level with wire bonding methods that enhance performance, streamline processes, and provide lasting design integrity.
Take your designs to the next level with wire bonding methods that enhance performance, streamline processes, and provide lasting design integrity.
Take your designs to the next level with wire bonding methods that enhance performance, streamline processes, and provide lasting design integrity.
성능을 향상하고 공정을 간소화하며 지속적인 설계 무결성을 제공하는 와이어 본딩 방법으로 설계를 한 단계 더 발전시키세요.
ワイヤボンディングによって、設計の強化、サイズの縮小、電力管理の改善、機械的信頼性の向上を実現する方法を確認しましょう。
Découvrez comment le câblage par fils peut améliorer vos conceptions, réduire leur taille, améliorer la gestion de l'énergie et augmenter la fiabilité mécanique.
Fortschrittliche Designs mit Drahtbonding-Methoden, die die Leistung verbessern, Prozesse rationalisieren und dauerhafte Designintegrität bieten.
Revoluciona tu enfoque de diseño de PCB y descubre de qué forma puede la unión por hilo aportar nuevas capacidades a tus proyectos. Este webinar te mostrará de qué manera la técnica de la unión de cables, también conocida como el wire bonding, simplifica tu proceso de diseño, eliminando la necesidad de trabajo manual o software externo, lo que te permite centrarte en la innovación.
La unión de cables ofrece distintas ventajas, como reducir el tamaño de tu diseño, mejorar la gestión de la energía y aumentar la fiabilidad mecánica. Aprovechando estas ventajas, conseguirás conexiones eficientes y un proceso de diseño racionalizado, lo que se traducirá en una optimización general del rendimiento y una mejor durabilidad de tu proyecto.
Acompáñanos para:
Lleva tus diseños al siguiente nivel con las técnicas de unión de cables que mejoran el rendimiento, agilizan los procesos y proporcionan una integridad duradera al diseño.
Victor is a Field Applications Engineer (FAE) at Altium, where he combines technical expertise with a customer-centric approach. With over 10 years of developing electronics for the automotive and railway industry and two years of experience as a dedicated 3D-Electronics application engineer, establishing strong client relations within the EMEA and North American market. His primary focus is to ensure customer satisfaction by providing simple solutions to the customer's complex problems.
Alex has a background in electrical engineering and a strong passion for technical marketing. Graduating with a bachelor’s in electrical engineering from Clemson University in 2018, he has since excelled in various roles within the technology sector. Starting his career at Kyocera AVX, Alex served as an RF Field Applications Engineer, establishing strong client relationships and designing passive bandpass filters and antenna systems. He then transitioned to TDK as an Account Executive, where he provided sales and technical support, leading a dynamic sales team and offering design assistance to customers. Currently, Alex is a Technical Marketing Engineer at Altium, leveraging his technical expertise to develop marketing materials.
Jan Grooten is an Electronics Design Engineer who graduated (MScEE) in Asic design at the University of Twente, Netherlands. Besides Altium, Jan’s work experience includes Ericcsson, Sony and Plantronics where he served as Electronic System Engineer with focus on product development for Bluetooth headsets, with specialisation in small Li-ion batteries and Power management IC's. Jan started his career at Altium in 2017 as Field Application Engineer and is a Certified Interconnect Designer by IPC Council.
Kunjal studied Electronic & Communication Engineering at university, and currently works as a Technical Application Engineer at Altium in the Altium Bangalore office in India. Kunjal has over 20 years of direct experience with IPC CID Certification as an Sr. PCB Designer in the Space industry, various design firms, PCB Fabrication, and assembly houses.
Aida works as a Technical Sales Engineer at Altium and is based in the Sydney, Australia office. Aida studied Electrical/Electronic Engineering and completed Master of Engineering (MEng) Field of Mechatronics, Robotics, and Automation Engineering from the University of Western Sydney (UWS). Aida also completed certificates in Microcontroller Programming, Project Management Principles and Practices Specialization from the university of UC Irvine California. Aida has experience as an Electrical Engineer, Business Development Manager, Project Manager, Operations Manager, most recently in the last 10 years prior to joining Altium working in Engineering Process improvement. The most important thing that she always focuses on in her career is communication and trust. Aida strongly believes that communication is the solvent of all problems, when the trust accountability is high, communication is easy, instant, and effective.
Aiden은 대학에서 전자공학을 전공하였으며 PCB 설계 분야의 R&D로 7년 이상의 경험을 가지고 있습니다. 그는 전자 제품을 위한 SMPS, 인버터, 컨버터 설계 경험이 있습니다. 제품 프로젝트를 이끌었으며 설계, 관리, 인증 제품 테스트와 같은 모든 작업을 경험했습니다. 그리고 한국 리셀러(Hancom Intelligence) 팀에서 4년 이상 Altium Designer 사용자들을 위한 기술 지원 및 교육을 제공했습니다. Concord Pro와 Altium 365를 사용하여 PLM 요구 사항에 대한 컨설팅 및 지원을 했습니다. 또한 Altium Designer에 대한 수십 차례의 교육 및 웨비나를 경험했습니다.
Aiden은 2022년 11월부터 Altium에서 기술 영업 엔지니어로 근무하고 있으며 현재 한국 사무소에 근무하고 있습니다.
Daniel joined Altium in 2019 as an Application engineer and moved into the Technical Sales role in the same year. Daniel provides technical assistance for sales, third party distributors, and customers in the Asia Pacific region (APAC) and is based in the Altium Tokyo, Japan office. Daniel has experience with PCB, FPGA, and ASIC design in telecommunication and Information industries.
Nourhene is an Electronic Engineer (PCB Design & FPGA Programming) with Masters in RFID. Nourhene joined Altium in 2019 as a Technical Sales Engineer and got CID certified in 2022. She works closely with the sales team taking care of both prospects and existing customers, supporting them with technical sales and marketing activities on Altium's products and services. Prior to Altium, Noushene worked as a PCB Designer within an international company where she designed PCBs for both commercial release and internal test applications. Based on her experience, Nourhene has a great understanding of customer's' needs and the challenges of PCB Design.
Martin Malenica has a masters in electronic and computer engineering at the University of Zagreb. His previous experience consists of multiple embedded systems positions at robotics start-ups (Gideon with USD 35m in Seed and Series-A funding) and SMEs. His engineering strengths lie in system architecture, PCB design and embedded programming. Aside from engineering, Martin has spent the last 1.5 years working at a leading European management consulting firm, where he focused on strategies to support large OEMs and Tier-1s regarding the current semiconductor shortage across the whole EMEA region. Martin has practical experience within AD, but also a good understanding of competitor tools, especially on the procurement and supply chain side, like Everstream, Resilinc, Silicon Expert, Z2Data etc. Martin Joined Altium in 2023 as part of the Technical Sales team in Germany.
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