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Learning Hub Webinars Unlock New Design Possibilities with Wire Bonding

Unlock New Design Possibilities with Wire Bonding

Revolutionize your PCB design approach and discover how wire bonding can bring new capabilities to your projects. This webinar will demonstrate how wire bonding simplifies your design process, eliminating the need for manual work or external software, allowing you to focus on innovation.

Wire bonding provides distinct benefits, such as reducing the size of your design, enhancing power management, and increasing mechanical reliability. By leveraging these advantages, you can achieve efficient connections and a streamlined design process, all while boosting your project's overall performance and durability.

Join us to:

  • Learn about the uses and benefits of wire bonding
  • See real-world examples that highlight increased design efficiency
  • Gain insights on optimizing your design process for better performance

Take your designs to the next level with wire bonding methods that enhance performance, streamline processes, and provide lasting design integrity.

Wire bonding

Registration has recently closed. Check back soon for on-demand webinar.

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Unlock New Design Possibilities with Wire Bonding

Created: September 29, 2024
At a Glance
Explore how wire bonding can enhance your designs, provide size reduction, improve power management, and increase mechanical reliability.
Go Deeper with AI:
ChatGPT Perplexity Claude Gemini Grok
9 videos
  • Hosted by Alex Hall - Technical Marketing Engineer
    00:34:01 • Oct 24, 2024
    Hosted by Alex Hall - Technical Marketing Engineer
    00:34:01 • Oct 24, 2024

    Take your designs to the next level with wire bonding methods that enhance performance, streamline processes, and provide lasting design integrity.

  • Hosted by Jan Grooten - Field Application Engineer
    00:50:17 • Oct 24, 2024
    Hosted by Jan Grooten - Field Application Engineer
    00:50:17 • Oct 24, 2024

    Take your designs to the next level with wire bonding methods that enhance performance, streamline processes, and provide lasting design integrity.

  • Hosted by Kunjal Patel - Field Application Engineer
    00:45:20 • Oct 24, 2024
    Hosted by Kunjal Patel - Field Application Engineer
    00:45:20 • Oct 24, 2024

    Take your designs to the next level with wire bonding methods that enhance performance, streamline processes, and provide lasting design integrity.

  • Hosted by Aida Gharahkhani - Field Application Engineer
    00:34:30 • Oct 23, 2024
    Hosted by Aida Gharahkhani - Field Application Engineer
    00:34:30 • Oct 23, 2024

    Take your designs to the next level with wire bonding methods that enhance performance, streamline processes, and provide lasting design integrity.

  • 오힘찬 FAE 발표
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    오힘찬 FAE 발표
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    성능을 향상하고 공정을 간소화하며 지속적인 설계 무결성을 제공하는 와이어 본딩 방법으로 설계를 한 단계 더 발전시키세요.

  • プレゼンター:ダニエル チョウ
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    プレゼンター:ダニエル チョウ
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    ワイヤボンディングによって、設計の強化、サイズの縮小、電力管理の改善、機械的信頼性の向上を実現する方法を確認しましょう。

  • Présenté par Nourhene Kerkeni - Field Application Engineer
    00:27:38 • Oct 24, 2024
    Présenté par Nourhene Kerkeni - Field Application Engineer
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    Découvrez comment le câblage par fils peut améliorer vos conceptions, réduire leur taille, améliorer la gestion de l'énergie et augmenter la fiabilité mécanique.

  • Präsentiert von Martin Malenica - Field Application Engineer
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    Präsentiert von Martin Malenica - Field Application Engineer
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    Fortschrittliche Designs mit Drahtbonding-Methoden, die die Leistung verbessern, Prozesse rationalisieren und dauerhafte Designintegrität bieten.

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    Presentado por Victor Rodriguez Silva - Field Application Engineer
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Revolutionize your PCB design approach and discover how wire bonding can bring new capabilities to your projects. This webinar will demonstrate how wire bonding simplifies your design process, eliminating the need for manual work or external software, allowing you to focus on innovation.

Wire bonding provides distinct benefits, such as reducing the size of your design, enhancing power management, and increasing mechanical reliability. By leveraging these advantages, you can achieve efficient connections and a streamlined design process, all while boosting your project's overall performance and durability.

Watch this webinar recording to:

  • Learn about the uses and benefits of wire bonding
  • See real-world examples that highlight increased design efficiency
  • Gain insights on optimizing your design process for better performance

Take your designs to the next level with wire bonding methods that enhance performance, streamline processes, and provide lasting design integrity.

Author

Author

Alex has a background in electrical engineering and a strong passion for technical marketing. Graduating with a bachelor’s in electrical engineering from Clemson University in 2018, he has since excelled in various roles within the technology sector. Starting his career at Kyocera AVX, Alex served as an RF Field Applications Engineer, establishing strong client relationships and designing passive bandpass filters and antenna systems. He then transitioned to TDK as an Account Executive, where he provided sales and technical support, leading a dynamic sales team and offering design assistance to customers. Currently, Alex is a Technical Marketing Engineer at Altium, leveraging his technical expertise to develop marketing materials.
 

More content by Alex Hall

Author

Author

Jan Grooten is an Electronics Design Engineer who graduated (MScEE) in Asic design at the University of Twente, Netherlands. Besides Altium, Jan’s work experience includes Ericcsson, Sony and Plantronics where he served as Electronic System Engineer with focus on product development for Bluetooth headsets, with specialisation in small Li-ion batteries and Power management IC's. Jan started his career at Altium in 2017 as Field Application Engineer and is a Certified Interconnect Designer by IPC Council.
 

More content by Jan Grooten

Author

Author

Kunjal studied Electronic & Communication Engineering at university, and currently works as a Technical Application Engineer at Altium in the Altium Bangalore office in India. Kunjal has over 20 years of direct experience with IPC CID Certification as an Sr. PCB Designer in the Space industry, various design firms, PCB Fabrication, and assembly houses.

More content by Kunjal Patel

Author

Author

Aida works as a Technical Sales Engineer at Altium and is based in the Sydney, Australia office. Aida studied Electrical/Electronic Engineering and completed Master of Engineering (MEng) Field of Mechatronics, Robotics, and Automation Engineering from the University of Western Sydney (UWS). Aida also completed certificates in Microcontroller Programming, Project Management Principles and Practices Specialization from the university of UC Irvine California. Aida has experience as an Electrical Engineer, Business Development Manager, Project Manager, Operations Manager, most recently in the last 10 years prior to joining Altium working in Engineering Process improvement. The most important thing that she always focuses on in her career is communication and trust. Aida strongly believes that communication is the solvent of all problems, when the trust accountability is high, communication is easy, instant, and effective.

More content by Aida Gharahkhani

Author

Author

Aiden은 대학에서 전자공학을 전공하였으며 PCB 설계 분야의 R&D로 7년 이상의 경험을 가지고 있습니다. 그는 전자 제품을 위한 SMPS, 인버터, 컨버터 설계 경험이 있습니다. 제품 프로젝트를 이끌었으며 설계, 관리, 인증 제품 테스트와 같은 모든 작업을 경험했습니다. 그리고 한국 리셀러(Hancom Intelligence) 팀에서 4년 이상 Altium Designer 사용자들을 위한 기술 지원 및 교육을 제공했습니다. Concord Pro와 Altium 365를 사용하여 PLM 요구 사항에 대한 컨설팅 및 지원을 했습니다. 또한 Altium Designer에 대한 수십 차례의 교육 및 웨비나를 경험했습니다.
Aiden은 2022년 11월부터 Altium에서 기술 영업 엔지니어로 근무하고 있으며 현재 한국 사무소에 근무하고 있습니다.

More content by Aiden Oh

Author

Author

Daniel joined Altium in 2019 as an Application engineer and moved into the Technical Sales role in the same year. Daniel provides technical assistance for sales, third party distributors, and customers in the Asia Pacific region (APAC) and is based in the Altium Tokyo, Japan office. Daniel has experience with PCB,  FPGA, and ASIC design in telecommunication and Information industries. 
 

More content by Daniel Cho

Author

Author

Nourhene is an Electronic Engineer specializing in PCB Design and FPGA Programming, holding a Master’s degree in RFID technologies. Since joining Altium in 2019, she has partnered closely with the sales team to support both prospects and existing customers through technical sales and marketing initiatives across Altium’s portfolio.

Before Altium, Nourhene designed complex PCBs for Automotive and Aerospace applications at large international companies, where she also managed comprehensive testing processes. She has extensive experience collaborating with PCB manufacturers across Europe and Asia. Nourhene holds CID certification and is a certified Altium Designer Trainer.

More content by Nourhene Kerkeni

Author

Author

Martin Malenica has a masters in electronic and computer engineering at the University of Zagreb. His previous experience consists of multiple embedded systems positions at robotics start-ups (Gideon with USD 35m in Seed and Series-A funding) and SMEs. His engineering strengths lie in system architecture, PCB design and embedded programming. Aside from engineering, Martin has spent the last 1.5 years working at a leading European management consulting firm, where he focused on strategies to support large OEMs and Tier-1s regarding the current semiconductor shortage across the whole EMEA region. Martin has practical experience within AD, but also a good understanding of competitor tools, especially on the procurement and supply chain side, like Everstream, Resilinc, Silicon Expert, Z2Data etc. Martin Joined Altium in 2023 as part of the Technical Sales team in Germany.
 

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Author

Author

Victor is a Field Applications Engineer (FAE) at Altium, where he combines technical expertise with a customer-centric approach. With over 10 years of developing electronics for the automotive and railway industry and two years of experience as a dedicated 3D-Electronics application engineer, establishing strong client relations within the EMEA and North American market. His primary focus is to ensure customer satisfaction by providing simple solutions to the customer's complex problems.

More content by Victor

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Watch Video
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Collaborative product development between the Electronic and Mechanical design domains brings unique challenges. Today, most companies are still using a file-based methodology (STEP, IDF, DXF, IDX) for creating and exchanging data between the two domains. This, for the most part, requires that the entire database is exchanged multiple times, resulting in README files, marked-up PDF’s and in-person meetings to review the updates and ensure they

Watch Video
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Depending on your relationship with Altium, the services offered on the Altium Platform will be experienced from within Altium Designer and through the platform's browser-based interface. This page takes a look at the latter and provides an overview of what you'll see when you register an Altium Account and sign in to the Altium Platform Interface. For the latest information on the security,…

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Read Documentation
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In early stages of electronic designs, it is important to define the design on the conceptual/functional level. This initial step serves as a crucial foundation for the entire development process, providing a high-level overview of the system's architecture and its primary elements. A well-crafted block diagram clarifies the major functional units of the electronic system and illustrates their…

Read Documentation
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Requirements Portal's Document Export wizard is your go-to for whipping up editable Microsoft Word *.docx files straight from your requirements and V&V activities. You can use predefined templates or upload your own templates. The wizard is fueled by the Python-Docx-Template library, which, in turn, leverages the Jinja Templating Engine. This dynamic duo allows you to craft custom templates…

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Requirements Portal has always prided itself in the fact that it reduces the need to manage documentation by housing and connecting the engineering data which typically resides in different document types belonging to different software tools. However, many of users still need to generate documentation for activities such as certification and change control, which should be done quickly with no…

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