Skip to main content
Mobile menu
Octopart Discover
Altium Develop
Altium Agile
Risorse e supporto
Free Altium 365 Tools
Gerber Compare
Online PCB Viewer
Risorse e assistenza
Learning Hub
Centro di assistenza
Documentazione
Webinar
Altium Community
Forum
Bug Crunch
Idee
Formazione
Laboratorio studenti
Centro docenti
Curriculum Altium Education
Altium Professional Training
Search Open
Search
Search Close
Accedi
PCB Multi-Layer e layer Stackup
Main menu
Home
Cerca per argomento
Collaborazione
Creazione Componente
Gestione Dei Dati
Uscite di Progettazione
ECAD/MCAD
高密度配線(HDI)設計
Connessione Design
Multi‑scheda
Layout PCB
Instradamento PCB
Catena PCB Fornitura
Integrità dell’alimentazione
Progettazione RF
Rigido-Flex
Cattura schematica
Signal Integrity
Simulazione / Analisi
Software
Develop
Discover
Agile
Altium 365
Altium Designer
Risorse
Programmi
Altium Academy
Engineering News
Guide
Newsletter
Podcast
Progetti
Corsi di formazione
Webinar
Libro bianco
Home
PCB Multi-Layer e layer Stackup
PCB Multi-Layer e layer Stackup
Sfoglia la nostra libreria di risorse per saperne di più su multistrato PCB design & StackUp strato
Altium's Solutions for PCB Layer Stackup
Tips for Layer Stack
PCB Stackup Basics
Layer Stack Documentation
Overview
guide
video
Tech Docs
All Content
Technical Documentation
Defining the Layer Stack in Altium Designer
The PCB is designed and formed as a stack of layers. In the early days of printed circuit board (PCB) manufacturing, the board was simply an insulating core layer clad with a thin layer of copper on one or both sides. Connections are formed in the copper layer(s) as conductive traces by etching away (removing) unwanted copper. Fast forward to today, where almost all PCB designs have multiple…
Technical Documentation
Defining Blind, Buried & Micro Vias in Altium Designer
The Role of the Via Vias are used to create the vertical, or layer-to-layer connections in a printed circuit board. In the early days of board fabrication, all of the vias passed all the way through the board, from one side to the other. These thru-hole vias are drilled after the layers are fabricated and the routing etched. The conductive via barrels are formed in the drilled holes using an…