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Altium Designer 19 vs Altium Designer 18 Feature Comparison Altium Designer 19 vs Altium Designer 18 Feature Comparison Read Article
1:06 Unified Design Environment - Benefits:PCBWorksvid Watch Video
6-Layer Stackup EMC Designing a 6-Layer PCB Stackup for Enhanced EMC 6-layer PCBs are an economical and popular stackup for a variety of applications with high net count and small size. Larger boards might work fine with a 4-layer stackup, where signal layers can be sacrificed to ensure isolation between each side of the board. With the right 6-layer stackup, you can suppress EMI between different layers and accommodate fine-pitch components with high net count. However, there are cases where it makes more sense Read Article
Tips for High Frequency PCB Design in Embedded Systems Tips for High Frequency PCB Design in Embedded Systems Today's high-speed embedded systems incorporate diverse functionality, components, digital interfaces, and of course, wireless/RF signaling. If you're designing embedded systems with any level of computing power that also includes an analog front end, then you have multiple mixed-signal design challenges to overcome. Whether it's a simple sub-1 GHz radio connection, Wifi/BLE, or multi-gigabit Ethernet, embedded systems need some way to interface Read Article
DFSI: Overcoming Channel Loss DFSI: Overcoming Channel Loss In a previous article, we established that loss is one of the primary signal integrity challenges to overcome. In this article, we’ll talk about the sources of loss, what you can do about them, and an often neglected aspect of loss. There are various options for reducing loss, in this article I’ll discuss how to: Change your architecture to orthogonal or cables Use better PCB materials with lower DF resin and smoother copper Add active repeaters Read Article
Design for Reliability with Yizhak Bot Design for Reliability with Yizhak Bot Design for Reliability. In this episode learn from Yizhak Bot what derating is and how you can work on the schematic level with their simulation software to eliminate field failures. Watch it here. Read Article
Weekly Digest: Preparing for IPC-6012E Weekly Digest: Preparing for IPC-6012E This week HDI expert Happy Holden reported on an important issue related to the upcoming IPC-6012E, Qualification and Performance Specification for Rigid Printed Boards in his article, The IPC Warning About Microvia Reliability for High Performance Products. Learn more about this warning regarding field and latent failures of high-profile HDI boards and what you can do if you want to get involved or get more information. Access Happy’s article Read Article
5:33 Top 5 reasons to upgrade Watch Video
Materials Science 101 with EIPC Chairman Alun Morgan Materials Science 101 with EIPC Chairman Alun Morgan How to choose materials? Talk to your manufacturers about the correct materials for your PCB Design, or click here to watch Judy Warner's interview with the materials scientist, Alun Morgan. Read Article
40:17 Altium Designer 19: Advanced Layer Stack Manager Watch Video
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