Octopart Edge: Part 7 - How to Balance the Major Cost Drivers for PCBAs

Webinar Overview:

In Part 7 of the Octopart Edge Series, Zach Peterson presented strategies for balancing key cost drivers in PCBA design. This session provided actionable insights for making cost-effective choices in materials, component packages, and assembly processes to help professionals reduce PCBA expenses without compromising performance.

Key Takeaways:

Main Cost Drivers in PCBA Design:

• PCB Material and Plating Costs:

  • Selecting materials with a balance of performance and cost (e.g., FR4, PTFE) can reduce overall expenses, especially in consumer products where high-performance isn’t a strict requirement.
  • Plating materials (e.g., ENIG vs. immersion silver) affect costs, reliability, and handling, with careful selection providing cost and performance benefits.

• Component Package and Attrition Considerations:

  • Different package sizes and configurations impact attrition, inspection needs, and rework efforts.
  • Smaller packages, like 0201s, require higher inspection and handling costs, and leadless packages (e.g., BGAs) need X-ray inspection for accurate soldering verification.

• Octopart’s Specification View:

  • Using Octopart’s advanced filtering options, such as partial part number searches and filters for specific specifications, helps identify components that meet cost-performance needs efficiently.

• Panel Utilization and Miniaturization:

  • Improving panel utilization minimizes per-board costs. Miniaturizing components can increase fabrication costs but may lead to overall savings if panel space is used effectively.

Package Comparison Example:

• Comparing two package options for the NRF52840 microcontroller showed that while the chip scale package is cheaper per part, it drives up PCB fabrication costs due to the HDI design process required—highlighting the importance of assessing total production costs, not just BOM prices.

What’s Next?

Join us for the next Octopart Edge webinar, "Reduce PCB Assembly Defects With Smart Package Selection," on November 19, 2024, from 1:00 PM to 1:30 PM EST. This session will cover the impact of package choices on assembly defects, with strategies to streamline processes and maintain quality.

Explore at Your Own Pace – On-Demand Recording:

If you missed this live session or would like to review the content, the webinar recording is available on-demand. Click below to access the recording and deepen your understanding of cost-effective component selection and PCBA design strategies with Octopart.