Sub-25 Micron Traces with Averatek ASAP Technology

| Created: July 13, 2021

Sub-25 Micron Traces with Averatek ASAP Technology

High-density designs, simplified. Averatek offers a disruptive solution for complex electronic design.

We are very fortunate to have the powerhouse executive team from Averatek Corporation, a company that develops and licenses advanced manufacturing processes for a variety of electronic products including very high density printed circuit boards, semiconductor packaging, and RF and millimeter-wave electronics.

Haris Basit, Averatek’s CEO together with Mike Vinson the COO, and Tara Dunn the VP of Business Development and Marketing will share with us some exciting breakthroughs in miniaturization technology.

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Show Highlights:

Introductions, and Averatek Technology Overview
- Founded out of SRI in Silicon Valley
- PCB Industry in North America is ripe for disruption
Definitions: MSAP, ASAP and Subtractive processes
- ASAP is Averatek semi-additive process and is achieved with a liquid metal ink catalyst and plated up from the seed layer
PCB design benefits of Averatek technology
- Simplify the design
- Reduction in number of layers and lamination cycles
- Increased density and miniaturization
- Signal integrity improvements
- Applications are military, medical and communications
Material suitable for ASAP high-performance design:
- Epoxy-based substrates
- High-frequency materials (including Teflon)
- High-speed materials
- Some flex materials
- Thin materials
Shorten the learning curve for PCB designers with Tomas Chester design project in partnership with Averatek coming soon on Altium Resource Hub
Example design optimization:
- Smaller footprint, increased panel usage
- 12 layer board became 8 layer board
- 3 lamination cycle to 1 lamination cycle
- Simplified design, increased reliability, significantly lower costs

Links and Resources:

Averatek Website
Fabricators offering Averatek:

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About Author

Judy Warner has held a unique variety of roles in the electronics industry for over 25 years. She has a background in PCB Manufacturing, RF and Microwave PCBs and Contract Manufacturing, focusing on Mil/Aero applications.

She has also been a writer, blogger, and journalist for several industry publications such as Microwave Journal, PCB007 Magazine, PCB Design007, PCD&F, and IEEE Microwave Magazine, and an active board member for PCEA (Printed Circuit Engineering Association). In 2017, Warner joined Altium as the Director of Community Engagement. In addition to hosting the OnTrack Podcast and creating the OnTrack Newsletter, she launched Altium's annual user conference, AltiumLive. Warner's passion is to provide resources, support, and advocate for PCB Design Engineers worldwide.