The Many Benefits of Additive Process in PCB Manufacturing

Zachariah Peterson
|  Created: April 1, 2022  |  Updated: April 5, 2022
The Many Benefits of Additive Process in PCB Manufacturing

In this episode, we will continue with the topic of Design WITH Manufacturing, and joining us is Mike Vinson, the Chief Operating Officer at Averatek. Mike will help us understand Averatek’s advanced PCB manufacturing processes, including the technology and chemistry behind A-SAP and 3D printing.

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Show Highlights:

  • Mike Vinson's background
  • Mike explains what is an Additive Process
    • A-SAP–a semi-additive process used to make very fine features for high definition, and high density interconnects on print circuit boards.
    • The ability to add metalization other than copper, such as platinum, gold, palladium
    • 3D printing–a fully-additive process where all of the material is just added on, and nothing is subtracted away
  • Averatek’s business’s scope
    • Licensing the technology and selling the chemistry
    • The current clientele is North America
    • Efficient and secure prototyping
  • Is the 3D surface solderable?
  • MIDs or molded interconnect devices, are cool, but are they affordable?
  • Tara Dunn, Averatek’s VP in Marketing, is the primary point of contact for licensing
  • What do the economic look like for A-SAP technology? Will it be accessible, and cost-effective?
  • Mikes talks about the scalability of materials set in A-SAP technology
  • How can PCB designers take advantage of the A-SAP capabilities so that they can create more compact, smaller features, more advanced products?
  • How about a transparent substrate? Averatek has worked with transparent polyimides and has done some other transparent substrates
  • What are the things to look forward to in additive processes and the additive manufacturing realm in general?

Links and Resources:

Connect with Mike Vinson on LinkedIn
Visit Averatek's website
Check out Tara Dunn’s Articles on Altium Resource Hub
Watch Previous Episode Mike Vinson:
    Sub-25 Micron Traces with Averatek ASAP Technology
    Semi-Additive Process Technology at Averatek
Connect with Zack on LinkedIn
 

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About Author

About Author

Zachariah Peterson has an extensive technical background in academia and industry. He currently provides research, design, and marketing services to companies in the electronics industry. Prior to working in the PCB industry, he taught at Portland State University and conducted research on random laser theory, materials, and stability. His background in scientific research spans topics in nanoparticle lasers, electronic and optoelectronic semiconductor devices, environmental sensors, and stochastics. His work has been published in over a dozen peer-reviewed journals and conference proceedings, and he has written 1000+ technical blogs on PCB design for a number of companies. He is a member of IEEE Photonics Society, IEEE Electronics Packaging Society, American Physical Society, and the Printed Circuit Engineering Association (PCEA), and he previously served on the INCITS Quantum Computing Technical Advisory Committee.

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