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  • Altium Designer

    Complete Environment for Schematic + Layout

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    Entry Level, Professional PCB Design Tool

  • CircuitMaker

    Community Based PCB Design Tool


    Agile PCB Design For Teams

  • Altium 365

    Connecting PCB Design to the Manufacturing Floor

  • Altium Concord Pro

    Complete Solution for Library Management

  • Octopart

    Extensive, Easy-to-Use Component Database

  • PDN Analyzer

    Natural and Effortless Power Distribution Network Analysis

  • See All Extensions

    World-Renowned Technology for Embedded Systems Development

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    Learn best practices with instructional training available worldwide

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  • Altium 365 Viewer

    View & Share electronic designs in your browser

  • Altium Designer 20

    The most powerful, modern and easy-to-use PCB design tool for professional use


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    About Author

    John Medina

    With over 30 years of extensive experience in PCB and Package design,
    training and Signal integrity analysis using state of the art tool sets,
    including Expedition, CES (Constraint Editor System), Altium, Hyperlynx,
    Interconnectix (ICX), Power SI,  Boardstation RE/XE and Allegro v16.x
    including CMS (Constraint Management System).
    John has expertise in complex PCB designs, and delivering training of PCB design tools and methodologies, including: HDI, high speed, RF, mobile wireless products, mixed technology designs, signal and power integrity verification and analysis
    using Hyperlynx tool suite, and Hyperlinx DRC.
    John has worked at Northrop Grumman completing PCB designs for Aerospace
    and Military products and has previously worked for Apple, HP, Agilent, Nokia and
    Cisco and built teams that deliver complex HDI CPU designs. He has also implemented a PCB Process and tool flows, which includes SI Tools for verification and worked at Intel doing Package Flip-Chip design for server team.
    Recently John worked for Mentor Graphics as a Field Application Engineer. He supported Qualcomm, Northrop Grumman and Intel providing expertise and training for
    Package/PCB co-design utilizing Xpedition Package Integrator. He has experience with Calibre LVS DRC. John also has a pending patent on Bump Compensation methodology.

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