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The major trend in the electronics industry is miniaturization, where more features and more complexity are packed into a smaller footprint and less board space. High density interconnect (HDI) PCB design is the manifestation of miniaturization at the circuit board level, where smaller components and higher density force changes in design practices and manufacturing processes. HDI PCBs are heavily rules-driven, with most of the rules involved...

The PCB materials industry has spent significant amounts of time developing materials that provide lowest possible signal loss. For high speed and high frequency designs, losses will limit signal propagation distance and distort signals, and it will create an impedance deviation that can be seen in TDR measurements. As we design any printed circuit board and develop circuits that operate at higher frequencies, it may be tempting to opt for the...

Of all the noise and operational challenges designers face in their PCBs, there is one overarching problem that is arguably most popular: electronic noise. Any noise you pinpoint in your system could have one or many possible causes and solutions. It could originate as an SI/PI problem, it could possibly arise from some external source, or it could be good old-fashioned crosstalk! Whenever some noise is measured on signals and it presents some...

Any time you design a PCB and want to turn it into a real product, you will have to make sure the design obeys the constraints within the standard PCB manufacturing process. This imposes multiple rules on any design, and ECAD software will enforce design rules as you create the board to ensure you obey these important constraints. The ever-increasing complexity of boards has made it nearly impossible to carry out the design rule verification...

Like any other advanced PCB, success in HDI design comes from designing the right stackup. While this is certainly true in terms of signal and power integrity, it also matters for manufacturing; the HDI PCB stackup you use must conform to a set of standard processing steps required to build up the board. According to the IPC-2226 HDI PCB standards, there are several types of standardized HDI PCB stackups that  One common HDI stackup used to...

Let’s talk about the future of printed circuit board prototyping. Sean Patterson, the President of Nano Dimension USA is here to introduce the technology behind DragonFly IV®, the multi-material 3D printer for electronics fabrication. He will walk us through its current capabilities, what it can do and what we may expect from it in the future. Sit back, relax and enjoy this episode. Make sure to watch through the end and check the show notes...

Altium Designer's world-class PCB design features help users quickly get started with new rigid-flex designs and prepare them for manufacturing. Rigid-flex in Altium Designer starts with designing a manufacturable PCB layer stack complete with via transitions and any calculated impedance requirements. Flex sections also need to be placed in the layer stack before moving into the PCB layout. Once inside the PCB editor, bending lines can be clearly...

There are two basic reasons for designing a flex circuit into your product: to build a compact and efficiently assembled device, or to make the circuit dynamically integrated with the mechanical function of the product. You may, of course, lean on both of these reasons for justifying the use of flex circuits. On this note, let’s look at some rigid-flex PCB applications and design examples to see the issues that spring to mind when designing flex...