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RF and microwave technologies are evolving at a rapid pace, and PCB design is changing right along with it. One of the most exciting innovations in the industry is Ultra High-Density Interconnect (Ultra HDI) technology. This advancement isn't just about packing more circuits into a smaller space, it's about improving performance, ensuring signal integrity, and tackling thermal challenges head-on. If you're designing PCBs for RF applications...

Behind every electronic device lies a complex web of components, each carefully selected and sourced by professionals who are making critical decisions daily. The tools these experts choose can mean the difference between efficiency and frustration, between meeting deadlines and falling behind. To understand how industry professionals navigate these challenges, Octopart conducted its annual user survey between November 12, 2024, and January 17...

Counterfeit components in aerospace electronics pose significant risks and challenges. These unauthorized and often substandard parts can compromise the safety, reliability, and regulatory compliance of aerospace systems. The presence of counterfeit components in critical aerospace applications can lead to catastrophic failures, endangering lives and causing substantial financial losses. Ensuring the authenticity of components is crucial to...

Wire harness failures can lead to costly recalls, production delays, and severe safety risks. While many harness failures result in inefficiencies that slowly erode profitability, others escalate into large-scale recalls and legal liabilities. The financial and operational consequences are enormous, but most of these issues can be avoided with the right design and validation tools. This article explores the hidden costs of poor wire harness...

Fill out the form on the side panel to download Altium's Guide to Requirements Management for Modern Electronic Hardware Teams.  This guide is filled with practical information to help electronic teams streamline requirements management, avoid costly delays, and enhance collaboration across hardware development projects using Altium 365 Requirements & Systems Portal. What's Inside This Guide? Readiness checklist: When is the time to move away...

Design Engineers vs. NPI Procurement: A Tale of Two Teams While stronger collaboration between design engineers and new product introduction (NPI) procurement teams has its benefits, it’s easy to understand why it doesn’t happen naturally.  Design engineers are often driven by two priorities: building world-class products and getting them to market fast. To them, procurement often feels like a bureaucratic roadblock. They see the rejection of...

The microprocessor industry is undergoing its most profound transformation since the rise of mobile computing. As Moore's Law approaches its practical limits, engineers are embracing radical architectural shifts – from AI-infused silicon to recyclable chiplet designs – to meet soaring demands for compute power, efficiency, security, and adaptability. For engineering professionals spanning the automotive, medical, industrial, and consumer...

In a modern automotive assembly plant, the most striking transformation isn't the robots welding chassis or painting bodies – it's the sheer amount of computing power being installed in each vehicle. As cars evolve from mechanical systems with electronic controls to computers on wheels, semiconductor design choices are reshaping everything from power management to passenger safety. This revolution in automotive architecture represents the...

Wire bonding is a key technology for connecting semiconductor dies to circuit boards, continuously evolving to meet the electronics industry's demand for miniaturization and compact design. It enables higher performance and computing power, making advanced sensors, lighting, and wide-bandgap semiconductors possible for high-power, high-density applications. Check out our brand-new, comprehensive whitepaper, where we cover everything you need to...