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The continued miniaturization of both packaging and component size in next-generation electronics is becoming harder and harder to work around and presents a significant challenge for both PCB designers and PCB fabricators.   To effectively navigate the constraints of the traditional subtractive-etch PCB fabrication processes, PCB designs require advanced PCB fabrication capabilities while pushing the limits of finer feature size, higher layer...

The electronics industry is constantly changing, especially when it comes to the supply chain. Components are constantly going out of stock or have ridiculous lead times making them non viable as a design option. These problems are ones we face everyday, but they don’t just affect the design that is currently being worked on, they affect all designs, even completed ones. Projects today rely on the instability of the components market but with...

In a previous article about circuit simulation and reliability, I looked at how Monte Carlo analysis is commonly used to evaluate circuits that are subject to random variations in component values. When we look specifically at components, there will always be some tolerances that will create variations in the electrical operating points of a circuit. These translate into some variation in the circuit’s output state, and the probable range of...

Field Programmable Gate Arrays, or FPGAs, have become ubiquitous amongst high-speed, real-time digital systems. They can be used for time critical applications, digital signal processing, or even crypto mining. Their efficiency in speed and power make them perfect for reusable high speed applications. The speed at which FPGAs operate continues to increase at a dizzying pace but their adoption into Continuous Integration (CI) pipelines seems not...

This track is for the engineer who understands high-speed design requirements and wants to learn design practices to help ensure signal integrity and EMC with fast digital protocols, mixed-signal boards, and high-layer counts. Slide Presentation PDF Review of impedance and material properties Understanding stack-ups for digital vs. high-frequency RF Choosing an interconnect style, planning for routing Front-end planning and considerations...

PCB stackups often incorporate slightly dissimilar materials that could pose a reliability problem. Hybrid PCBs are one case where the PCB stackup will include different materials, typically a standard FR4 laminate and a PTFE laminate for RF PCBs. While I was at PCB East last month, I received a question about the reliability of these stackups and what factors could influence reliability, quality, and yield during manufacturing. After doing some...

Continuing our discussion on PCB design education, in this episode, joining us is Fergus Downey. Fergus is a Ph.D. student and research assistant at Curtin University in Western Australia (WA) and is currently involved in the Binar Space Program. Today, we will tackle the education and opportunities related to Mechatronic Engineering and a little overview of CubeSat. Listen to the Podcast: Download this episode (right click and save) Watch...

In today's business age, implementing a transformative digitalization strategy is one of the big keys to a company's ongoing and future success. By adopting and integrating digital platforms, smart applications, and managed services, businesses can transform business processes and product development. Why Startups Should Embrace Digitalization Digitalization allows companies to quickly adapt to changing market dynamics and customer expectations...

This track is for the designer who is new to high-speed layout and routing practices and wants to understand how they relate to signal integrity, and how to get started designing for high-speed digital applications. Slides From Presentation Stackups - material selection, planning the stack-up to support routing How to design stack-ups to balance impedance, power, and ground Different types of interconnects supported in Altium Designer...