Advanced Topics in High-Speed Design

Zachariah Peterson
|  Created: May 11, 2022  |  Updated: May 22, 2024

This track is for the engineer who understands high-speed design requirements and wants to learn design practices to help ensure signal integrity and EMC with fast digital protocols, mixed-signal boards, and high-layer counts.

Slide Presentation PDF

  • Review of impedance and material properties
  • Understanding stack-ups for digital vs. high-frequency RF
  • Choosing an interconnect style, planning for routing
  • Front-end planning and considerations during PCB layout/routing

About Author

About Author

Zachariah Peterson has an extensive technical background in academia and industry. He currently provides research, design, and marketing services to companies in the electronics industry. Prior to working in the PCB industry, he taught at Portland State University and conducted research on random laser theory, materials, and stability. His background in scientific research spans topics in nanoparticle lasers, electronic and optoelectronic semiconductor devices, environmental sensors, and stochastics. His work has been published in over a dozen peer-reviewed journals and conference proceedings, and he has written 2500+ technical articles on PCB design for a number of companies. He is a member of IEEE Photonics Society, IEEE Electronics Packaging Society, American Physical Society, and the Printed Circuit Engineering Association (PCEA). He previously served as a voting member on the INCITS Quantum Computing Technical Advisory Committee working on technical standards for quantum electronics, and he currently serves on the IEEE P3186 Working Group focused on Port Interface Representing Photonic Signals Using SPICE-class Circuit Simulators.

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