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PCB design follows a specific workflow involving schematic capture, PCB layout, and generation of outputs. Where should thermal analysis and reliability enter in to the standard PCB design workflow? These considerations arise at multiple points during design as thermal management challenges create reliability problems in components and the completed PCBA. Thermal management in your printed circuit board focuses on directing heat from hot to cool...

Design of PCBs and thermal management are intimately linked as thermal problems are known to significantly reduce the useful lifetime of a circuit board and components. Heat that is generated in a circuit board by active and passive components tends to be confined near the components, leading to a high-temperature increase due to the low thermal conductivity of most circuit board substrates. Frequent cycling of a circuit board and components...

The physical and electrical demands on PCBs in avionics systems are among the most intense in all engineering fields. These systems must withstand significant mechanical demands while remaining within an acceptable temperature range. Within aerospace engineering, design techniques for thermal management for avionics systems is an active area of development as more mechanical systems are replaced with equivalent electronic systems. In addition to...

One of the most common PCB assembly defects discussed in guides on DFA is tombstoning, with the second most common probably being cold joints, with the latter being pointed out specifically on through-hole pins. While these two may not seem to be related, they are both related to heat flowing away from a pin or pad on a component. In PCB layout, this is addressed by adding a thermal relief pad onto the affected component so that heat is confined...

The thermal conductivity of your PCB material stackup and arrangement of copper conductors are important factors that determine the thermal performance of your circuit board. You will likely need to include strategically placed thermal vias, a heat sink on each active component and power electronics, and active cooling measures near any other heat source on your circuit board. Copper in printed circuits has high thermal conductivity, while FR4...

An active component can act like a powerful heat source in your board, ultimately determining the equilibrium temperature in your PCB. Frequent cycling between high and low temperatures, as well as running active components at high temperature for extended periods of time, will reduce the longevity of your system and can lead to premature component or conductor failure. These heat transfer and temperature problems can be prevented with a thermal...

The physical properties of your PCB substrates and copper conductors are the primary factors that determine how it will perform under pressure. Thermal properties, rigidity, dispersion, relative permittivity, and more will affect signal integrity, thermal management, and mechanical performance of your circuit board. When it comes to thermal conductivity, choosing the right substrate can help you combat temperature rise in your board with...

There’s a multitude of component manufacturers, and each produces a huge number of components. No one can keep track of all information for every circuit board part. PCB components contain more information than just electrical specifications. Your PCB components also contain pin layouts, schematic symbols, SPICE model information, and even 3D models. Today’s PCB design teams need solutions to help them keep their circuit board parts and libraries...

Whenever a design needs to be prepared for manufacturing, designers need to prepare multiple pieces of documentation to help them get into fabrication. In addition to supplying copies of design files, PCB designers need to provide standard fabrication and assembly drawings to thoroughly communicate their design intent to a manufacturer. A PCB designer shouldn’t have to use external drafting tools to create a PCB fabrication drawing and other...