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Design reviews play a critical role in the development and regulatory approval of medical devices. Within the framework of the FDA’s Quality System Regulation (QSR), specifically under 21 CFR Part 820.30, design reviews are not just procedural formalities, they are essential checkpoints that help ensure a device is safe, effective, and meets both user needs and regulatory expectations. These reviews are structured opportunities for cross...

We’ve all been there, you submit what looks like a solid design, only to run into questions about material substitutions, unexpected impedance calculation results, or a worst-case scenario, a PCB that comes back from the fabricator warped beyond usability. While there are many variables that impact yield and reliability, your PCB stack-up is often the unsung hero, or the hidden culprit. For PCB designers working on high-density, high-speed, flex...

A lot of PCB designers work in the DC power domain, and as a result we often talk a lot about DC power monitoring, control, and circuit design. But AC power matters too, and it has its own control techniques that are intended to reduce EMI, provide safety measures for loads and downstream regulators, and modulate power delivery to a load. Zero-cross switching is one such strategy used to help manage EMI and safety in AC power systems Zero-cross...

The relentless drive for smaller, faster, and more powerful electronic devices brings a persistent adversary: heat. Thermal issues are a leading cause of product failure, with some studies indicating that approximately 55% of electronic equipment failures are related to high temperatures. A mere 10°C rise above a component's normal operating range can halve system reliability, indicating that the issue extends beyond outright failure. Despite...

Component datasheets are the bedrock of electronic design, serving as the official instruction manual with detailed electrical characteristics, physical dimensions, and recommended operating conditions. For any engineer, the datasheet is the non-negotiable starting point. However, datasheets represent a baseline understanding. In reality, the journey from individual components to a reliable and manufacturable product involves considerations that...

Engineering teams globally know the frustration: days before a prototype build or production run, a key component in the "finalized" Bill of Materials is found to be obsolete, out-of-stock, or facing a crippling lead time. This triggers a high-stakes scramble – late-night redesigns, frantic supplier calls, and jeopardized project timelines. Far from being an isolated incident, occurrences like these highlight systemic flaws in traditional BOM...

At some point in every product lifecycle, engineers face an inevitable dilemma: stick with that EOL (End-of-Life) part and risk future manufacturing issues, or replace it with something newer and potentially introduce compatibility problems? Even what appears to be a straightforward substitution can lead to costly mistakes. The key to navigating these decisions successfully is ensuring you have access to accurate, current component data. The...

In the race to deliver faster, denser and more intelligent wireless systems, the antenna has quietly moved from the fringe of the design process to the center. Nowhere is that shift more apparent than in the rise of antenna-in-package (AiP) technology, a design approach that embeds high-frequency antennas directly into the semiconductor package. For engineers working at the intersection of RF design and systems integration, AiP represents a...

The rollout of 5G networks has already pushed electronic components to new limits. Now, with 6G on the horizon, engineers are entering an era where gigahertz (GHz) no longer stretch far enough. Sub-terahertz (Sub-THz) frequencies, ultra-low latency and bandwidths in the hundreds of gigahertz are all driving a new wave of innovation in devices, networks and within the components themselves. For electronics engineers, this is a tectonic...