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Using Skip Vias vs. Blind Vias to Build High Density Interconnect PCBs
All high-density PCBs rely on specific via styles to make connections into the inner layers without taking up space for
Thought Leadership
Increase Your Component and Trace High Density With Via-in-pad Plated Over Technology
I’ve got this awesome four-speaker stereo system with a subwoofer in my apartment that my neighbors love to hate. As
Thought Leadership
Component Information Management in a Unified Design Environment
Selecting components for your PCB device gives it life and should be performed carefully. If you have ever looked for
Should You Use Thick or Thin FR4 for Your PCB Substrate?
If you’ve ever made a pie with your kids, you know that the thickness of your crust is important. Too
Thought Leadership
Design for Easy Processes: Create and Link Supplier Data to Any Component
If you’ve spent any time with Altium Designer, you’ll already have some familiarity with the ease and simplicity behind such
Customer Success Stories
BAE Systems
Discover how BAE Systems improved project time frames while ensuring that designs perform as expected early in the development cycle using Altium Designer.
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