Engineering News

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Altium Designer 20.1 + Altium 365 Available Now!

Altium 365 + Altium Designer 20.1 Released Today - Work from Anywhere, Connect with Anyone 3 min Engineering News Altium 365 is the world’s only cloud platform for printed circuit board design and realization. Seamlessly accessible from Altium Designer

Are We Poised on the Brink of a New Age?

Are We Poised on the Brink of a New Age? 8 min Engineering News A new material shaped like a one-dimensional DNA helix can be used to build transistors with diameters of only two nanometers.

The Moon by 2024, Mars by 2040, and Then?

The Moon by 2024, Mars by 2040, and Then? 8 min Engineering News It seems the chances are improving that we will one day become a true space-faring species.

Altium Designer Getting Started User Guide

Level Up Your Design Skills - Altium Designer Getting Started User Guide 3 min Engineering News We are happy to announce the release of the new Altium Designer Getting Started User Guide. Whether you are new to Altium Designer or you want to brush up on some topics, the Altium Designer Getting Started User Guide will take you from a beginner to a master in PCB design. This is only the beginning! This guide will be updated with new information based on user feedback. Let’s first go over the contents of the guide.

Arduino Portenta H7 Brings Dev Boards to Production Grade

Arduino Portenta H7 Brings Dev Boards to Production Grade 5 min Thought Leadership When I hear the name “Arduino,” I don’t usually think of production-grade hardware. I’m not talking down to the folks

GaN MMIC Power Amplifier Market Outlook and Applications

GaN MMIC Power Amplifier Market Outlook and Applications 5 min Engineering News The next smartphone you buy is likely to include a GaN MMIC power amplifier for wireless communication. What was formerly

PCBs vs. Multichip Modules, Chiplets, and Silicon Interconnect Fabric

PCBs vs. Multichip Modules, Chiplets, and Silicon Interconnect Fabric (2023 Update) 6 min Engineering News An article in the September 2019 issue of IEEE Spectrum claimed that silicon interconnect fabric, a method for connecting chiplets