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Ten 32-bit MCUs Powering Next-Gen Embedded Systems Ten 32-bit MCUs Powering Next-Gen Embedded Systems In 1974, Texas Instruments released the TMS1000, the first commercially available microcontroller (MCU). This groundbreaking (for its time) component combined a 4-bit CPU, 1 KB ROM, 256-bit RAM and input/output lines, all on a single chip. Today, a high-performance 32-bit MCU sporting 2MB of on-chip SRAM can reach speeds of 1 GHz, running at least 2,500 times faster than the pioneering TMS1000. Microcontrollers have evolved from simple Read Article
Advanced Security Features in Modern 32-bit MCUs Advanced Security Features in Modern 32-bit MCUs The rapid proliferation of connected devices has substantively changed the security landscape for embedded systems. Modern 32-bit microcontrollers (MCUs) now serve as the first line of defense against an increasingly sophisticated array of security threats, from device cloning and firmware tampering to side-channel attacks that exploit subtle variations in power consumption or electromagnetic emissions. This evolution has driven MCU manufacturers Read Article
EN-November_OnTrack_Thumbnail Semiconductor Sales Are Up, Silicon Valley Invests in Mexico Semiconductor sales are up year-over-year, but FPGA market growth looks uncertain. Read Article
PCB Component Sourcing BOM Management Strategies for Boosting Procurement Efficiency in Electronic Component Sourcing Boost electronic component sourcing efficiency with periodic BOM reviews. Ensure accurate part data, spot sourcing issues early, and streamline procurement. Read Article
PCB electronic component switch Switch Solutions for Demanding Applications Reliable, quality switches are essential for operating any device, and certain applications demand high-current, sealed switches for optimum performance. High-current switches are specialized electromechanical devices that are capable of handling significant electrical currents while connecting or disconnecting a power source from a load. They play a crucial role in managing high voltages while also protecting circuits from damage. They’re used Read Article
How the 600nm Phase-Out Will Impact Legacy Systems How the 600nm Phase-Out Will Impact Legacy Systems The semiconductor industry is on the brink of a significant transition as it phases out 600nm wafers. This shift, driven by advancements in technology and the need for more efficient manufacturing processes, will have profound implications for legacy systems that rely on these older nodes. In this article, we will explore the impact of the 600nm phase-out, provide a historical overview of wafer volumes, and discuss the broader context of the Read Article
European NIS2 Directive Overview Overview of the European NIS2 Directive NIS2 is a new EU directive you need to pay attention to. While there's no denying that digitalization has made for more efficient internal and external processes, easing the movement of goods and minimizing costs, it's this very reliance on interconnected digital systems that has left manufacturers—and their value chains—vulnerable to an unprecedented level of cybersecurity threats as cybercriminals increasingly target vulnerabilities within the Read Article
DFARS Compliance Checklist DFARS Compliance Checklist for Electronics Design Teams Learn how to protect sensitive data, mitigate risks, and ensure regulatory compliance for Department of Defense contracts with this DFARS compliance checklist. Read Article
How to Lead a Successful Requirements Review Process How to Lead a Successful Requirements Review Process Learn how to lead effective requirements reviews for electronics projects. Reduce rework and streamline workflows with requirements management tools. Read Article
Backdrill-and-Fill For Blind and Buried Vias in PCBs Backdrill-and-Fill For Blind and Buried Vias in PCBs Blind vias aren’t just for HDI PCBs, they are also used in standard builds with mechanical drilling and no thin outer layers or build-up film layers. These designs find their home in many different systems, and for me this is most common in high-speed designs or RF designs that require terminated holes for press-fit pins or threaded pins. No matter what the application is, the presence of these holes drives a multiple lamination process to drill Read Article
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