Solving Modern PCB Layout Challenges PCB technology advances are a two-edged sword. They have increased the power and applicability of electronics. But they also make PCB layout more difficult, raising the risk of longer time-to-market cycles and higher product costs. Designers can mitigate these risks by using a unified PCB layout software package that provides the automation necessary to bring products to market quickly and on-budget. INTRODUCTION “Honey, I shrunk the kids.” “It’s Read Article The 4 Challenges to Transforming Data Management and Documentation into Designs To learn more about this topic please see the full solution - The 4 Challenges to Transforming Data Management and Documentation into Designs - at Altium.com. Read Article Data Management - Pain Point Assessment It’s that phase of the project when you’re about to hand over a development released product to production. From the development perspective, everything, from designs, parts, models, BOMs, and documentation, are all in their release state. It’s a time that calls for a true celebration after weeks of sleepless nights to finish the design on time and within budget. Then you get the flash back with few what-if questions; did sourcing get the new Read Article Managing Your PCB Work-in-Progress Data The recent trends of shorter product lifecycles have resulted in increased customer expectations that crave quick delivery of feature-rich products. Electronic companies that haven’t progressed their design process and remain stuck with the conventional way of managing their ECAD data find it to be very costly and inefficient. With market pressures that leave no margin for error, electronic companies that don’t address the needs of today’s Read Article ECAD Design Data Release Management There is no question that many of the our recent technological advancements, have been in fact within the communication realm! From the internet, cell phones, satellites, Facebook, and so on, it’s all been geared for us to easily communicate and collaborate. However, with all this technology in the palm of our hands, many companies today still struggle communicating their ECAD data releases. Whether it is to internally collaborate with peers and Read Article Eliminate Mistakes in Your Schematics with Electronic Rule Checking In times of rising design complexity and shortened timelines, it’s more and more for mistakes to sneak through in the schematic that can translate to the printed circuit board. Read on to find out how to easily identify and eliminate issues in your schematic with the Electronic Rule Checking your PCB in Altium Designer®. Many designers and companies put all their efforts in having a proper PCB layout and, nowadays, checking in real time the Read Article Getting Your Layer Stack Right An improper layer stack in your PCB design is one of the most common errors leading to fabrication failures and rejects. Every multilayer circuit board needs a precise PCB stack-up and accurate layout before it can be sent for PCB manufacturing. When you have the right set of circuit board design tools, you can turn your stackup into a real PCB layout and prepare the documentation your fabricator needs. The multi-layer PCB troubleshooting tools Read Article Multiple Licenses Read Article Single License Read Article Altium Designer 19 vs Altium Designer 18 Feature Comparison Read Article 1:06 Unified Design Environment - Benefits:PCBWorksvid Watch Video 4:11 Grids And Alignment - How-To:PCBWorksvid Watch Video Designing a 6-Layer PCB Stackup for Enhanced EMC 6-layer PCBs are an economical and popular stackup for a variety of applications with high net count and small size. Larger boards might work fine with a 4-layer stackup, where signal layers can be sacrificed to ensure isolation between each side of the board. With the right 6-layer stackup, you can suppress EMI between different layers and accommodate fine-pitch components with high net count. However, there are cases where it makes more sense Read Article Tips for High Frequency PCB Design in Embedded Systems Today's high-speed embedded systems incorporate diverse functionality, components, digital interfaces, and of course, wireless/RF signaling. If you're designing embedded systems with any level of computing power that also includes an analog front end, then you have multiple mixed-signal design challenges to overcome. Whether it's a simple sub-1 GHz radio connection, Wifi/BLE, or multi-gigabit Ethernet, embedded systems need some way to interface Read Article DFSI: Overcoming Channel Loss In a previous article, we established that loss is one of the primary signal integrity challenges to overcome. In this article, we’ll talk about the sources of loss, what you can do about them, and an often neglected aspect of loss. There are various options for reducing loss, in this article I’ll discuss how to: Change your architecture to orthogonal or cables Use better PCB materials with lower DF resin and smoother copper Add active repeaters Read Article Design for Reliability with Yizhak Bot Design for Reliability. In this episode learn from Yizhak Bot what derating is and how you can work on the schematic level with their simulation software to eliminate field failures. Watch it here. Read Article Weekly Digest: Preparing for IPC-6012E This week HDI expert Happy Holden reported on an important issue related to the upcoming IPC-6012E, Qualification and Performance Specification for Rigid Printed Boards in his article, The IPC Warning About Microvia Reliability for High Performance Products. Learn more about this warning regarding field and latent failures of high-profile HDI boards and what you can do if you want to get involved or get more information. 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