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There are numerous resources available that can enable you to bring AI into your product line. However, if you are new to AI, the path from prototype to production can seem daunting. There are new technologies to consider, making developing an AI model a very different beast compared to traditional linear programming. Estimating the processing and memory resources you’ll need can seem somewhat challenging as well. While implementing AI can be...

I’ll admit, I’m a big fan of Raspberry Pi. This set of inexpensive boards packs plenty of general purpose computing power into a small form factor, it easily connects to a LAN/WiFi and is accessible via SSH, and its memory is easily expandable with a micro SD card. It’s also easy to get a new prototype embedded application up and running directly from your laptop. The one aspect that prevents its application as a production-grade embedded system...

Remote collaboration tools are everywhere these days, and now designers have access to a convenient collaboration system for electronics design. Whether you’re part of a design team, or you need to quickly execute any design changes recommended by your manufacturer, you need cloud collaboration tools that are immediately accessible within your PCB design application. Now with Altium 365, you’ll have access to a cloud-driven design interface that...

Conceptually, differential pairs are very simple, being just a pair of equal and opposite polarity signals running on two parallel conductors. In terms of signal integrity, differential pair routing becomes progressively more difficult when frequencies get higher. At the low end of the possible range of rise time values and frequencies, timing is the main constraint, while at faster rates we see issues with skew, mode conversion, and bandwidth...

As I've discussed in earlier articles, there are many factors at play in determining the impact of inductance on high-frequency power distribution systems. Two topic areas, inductance of the decoupling capacitor and inductance of the power planes, were addressed in earlier articles. This article will focus on the inductance of the capacitor footprint and via inductance from the capacitor footprint back to the PCB power planes. Included are the...

In this session, we will cover Draftsman for design documentation, FAB/Assembly house file generation and automating their creation using Outjobs.

This tech track will discuss DDR and BGA Routing Best Practices and addresses the challenges to the designer and illustrates the various options for BGA fanout and the balanced routing constraints needed for fanning out to DDR memories.

In a previous two-part article, I described the PCB fabrication operations relative to inner layer processing, lamination, drilling and plating. The last step in the process is outer layer processing which is described below. For a detailed description of outer layer finishes; how different vias are formed and the steps involved in the multilayer build-up process, please refer to my previous blog.  The Start of Outer Layer Processing Once the...

In Part 1 of this article, I described the first steps that occur during the PCB fabrication process. They detailed the inner layer processing effort as well as the efforts that take place during the transition from inner layer processing to lamination. This part of the article will provide a detailed description of the lamination, drilling and plating processes. The goal of these two articles is to familiarize designers and design engineers...