An Overview Of PCB Outer Layer Processing
In a previous two-part article, I described the PCB fabrication operations relative to inner layer processing, lamination, drilling and plating. The last step in the process is outer layer processing which is described below. For a detailed description of outer layer finishes; how different vias are formed and the steps involved in the multilayer build-up process, please refer to my previous blog.
The Start of Outer Layer Processing
Once the...